H05K 13/0482
Using templates
Official title: {using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached}
H05K13/0482 (Using templates) appears on 56 US grants and 15 published applications in this corpus.
Search patents in H05K- Granted patents
- 56
- Published applications
- 15
- Assignees
- 36
- Inventors
- 123
- Latest grant
- 25 Mar 2025
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| 2022 | 0 | 3 |
| 2023 | 1 | 1 |
| 2024 | 1 | 0 |
| 2025 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Electronic component transfer apparatus, electronic component transfer method, and method of manufacturing a light-emitting diode panel25 Mar 2025US 12,261,071 B2Asti Global Inc., Taiwan
- Electronic component mounting device for mounting electronic components at certain intervals10 Sep 2024US 12,089,340 B2Hallys Corporation
- Electrical element transfer apparatus31 Oct 2023US 11,805,633 B2Samsung Electronics Co., Ltd.
- Method of preparing a setup kit for a placement machine18 Aug 2020US 10,750,651 B2Sick AG
- Pick and place apparatus18 Oct 2011US 8,038,191 B2Techwing Co., Ltd.
- Long body winding structure and respective long body27 Apr 2023US 2023/0129549 A1Sumitomo Wiring Systems, Ltd.
- Electronic component transferring apparatus, electronic component transferring method and manufacturing method of light-emitting diode panel10 Nov 2022US 2022/0359253 A1Asti Global Inc., Taiwan
- Electronic component transfer apparatus, electronic component transfer method, and method of manufacturing a light-emitting diode panel10 Nov 2022US 2022/0359254 A1Asti Global Inc., Taiwan
- Electronic component mounting device, method for manufacturing electronic device, and method for manufacturing strap21 Jul 2022US 2022/0232745 A1Hallys Corporation
- System and method for aligning micro light-emitting diodes23 Dec 2021US 2021/0398837 A1Innostar service Inc.
Most cited
By later US patents
- Method and apparatus for the assembly of microfabricated devices153US 5,355,577 A1994
- Device for the simultaneous mounting of components on a carrier85US 4,465,206 AU. S. Philips Corporation · 1984
- Multi-spindle pick and place method and apparatus48US 5,040,291 AUniversal Instruments Corporation · 1991
- Device for the simultaneous positioning of a plurality of electrical and/or electronic parts on a printed circuit board47US 4,452,557 AU. S. Philips Corporation · 1984
- Chip alignment method47US 4,893,403 AHewlett-Packard Company · 1990