Electronic component mounting device, method for manufacturing electronic device, and method for manufacturing strap

A method for manufacturing an electronic device, wherein a plurality of electronic components placed in a predetermined portion are mounted on attachments at different intervals from each other, the method comprising:

• removing some of the plurality of the electronic components being placed in the predetermined portion;
• transporting, wherein the electronic components removed in the removing are transported, the electronic components are moved so that the plurality of the electronic components are at the different intervals at which they will be mounted on the attachments before reaching the attachments, and the electronic components are transported to the attachments;
• and
• mounting and transferring, wherein the electronic components transported in the transporting are mounted on predetermined positions of the attachments.

A method for manufacturing an electronic device, wherein a plurality of electronic components are simultaneously mounted on attachments at different intervals from each other, the method comprising:

• removing, wherein the plurality of the electronic components are removed from a predetermined portion and held;
• a first transporting, wherein the plurality of the electronic components removed in the removing are transported to an alignment portion, and the electronic components are placed on the alignment portion;
• a second transporting, wherein the electronic components placed on the alignment portion are transported to the attachments while being held;
• and
• mounting and transferring, wherein the electronic components transported in the second transporting are mounted on predetermined positions of the attachments.

A method for manufacturing an electronic device, wherein a plurality of electronic components are simultaneously mounted on attachments at different intervals from each other, the method comprising:

• removing the plurality of the electronic components from a predetermined portion;
• holding, wherein the plurality of the electronic components removed in the removing are arranged at the different intervals at which they will be mounted on the attachments, and held by a transport mechanism;
• transporting the electronic components being held by the transport mechanism to the attachments;
• and
• mounting and transferring, wherein the electronic components transported in the transporting are mounted on predetermined positions of the attachments.