Electronic component transferring apparatus, electronic component transferring method and manufacturing method of light-emitting diode panel

An electronic component transferring method, comprising:

• providing a flexible carrier, wherein a surface of the flexible carrier carries an electronic component,
• providing a target substrate, wherein a surface of the target substrate is provided with a solder pad;
• arranging the surface of the flexible carrier carrying the electronic component and the surface of the target substrate provided with the solder pad to be opposite to each other, wherein a solder is provided on at least one of the electronic component and the solder pad;
• providing an abutting component transparent to light and located at an original position, moving the abutting component away from the original position towards a surface of the flexible carrier not carrying the electronic component, allowing the abutting component to abut against the surface such that the flexible carrier deforms, and allowing the electronic component to move towards the target substrate;
• providing a sensing beam and allowing the sensing beam to penetrate the abutting component to reach the flexible carrier and the electronic component to generate a first reflected light signal;
• providing an energy beam, allowing the energy beam to penetrate the abutting component, melting the solder between the electronic component and the solder pad, and soldering the electronic component onto the target substrate through the solder;
• returning the abutting component to the original position and generating, by the sensing beam, a second reflected light signal;
• and
• comparing the first reflected light signal and the second reflected light signal to confirm whether the electronic component is transferred onto the target substrate.

An electronic component transferring method, comprising:

• providing a flexible carrier, wherein a surface of the flexible carrier carries an electronic component,
• providing a target substrate, wherein a surface of the target substrate is provided with a solder pad;
• arranging the surface of the flexible carrier carrying the electronic component and the surface of the target substrate provided with the solder pad to be opposite to each other, wherein a solder is provided on at least one of the electronic component and the solder pad;
• providing an abutting component transparent to light and located at an original position, moving the abutting component away from the original position towards a surface of the flexible carrier not carrying the electronic component, allowing the abutting component to abut against the surface such that the flexible carrier deforms, and allowing the electronic component to move towards the target substrate;
• capturing, by the abutting component, an image of the electronic component to obtain a first image;
• providing an energy beam, allowing the energy beam to penetrate the abutting component, melting the solder between the electronic component and the solder pad, and soldering the electronic component on the target substrate through the solder;
• returning the abutting component to the original position, capturing, by the abutting component, an image of the electronic component to obtain a second image;
• and
• comparing the first image and the second image to confirm whether the electronic component is transferred onto the target substrate.