H03H 9/1064
For surface acoustic wave [saw] devices
Official title: {for surface acoustic wave [SAW] devices}
H03H9/1064 (For surface acoustic wave [saw] devices) appears on 929 US grants and 1,010 published applications in this corpus.
Search patents in H03H- Granted patents
- 929
- Published applications
- 1,010
- Assignees
- 173
- Inventors
- 1,266
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 4 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 3 | 0 |
| 1995 | 9 | 0 |
| 1996 | 5 | 0 |
| 1997 | 5 | 0 |
| 1998 | 13 | 0 |
| 1999 | 15 | 0 |
| 2000 | 16 | 0 |
| 2001 | 14 | 10 |
| 2002 | 20 | 27 |
| 2003 | 20 | 23 |
| 2004 | 18 | 53 |
| 2005 | 28 | 46 |
| 2006 | 30 | 47 |
| 2007 | 40 | 34 |
| 2008 | 26 | 22 |
| 2009 | 27 | 19 |
| 2010 | 16 | 31 |
| 2011 | 25 | 21 |
| 2012 | 24 | 25 |
| 2013 | 26 | 29 |
| 2014 | 22 | 40 |
| 2015 | 26 | 31 |
| 2016 | 32 | 35 |
| 2017 | 31 | 60 |
| 2018 | 33 | 57 |
| 2019 | 60 | 63 |
| 2020 | 61 | 75 |
| 2021 | 39 | 50 |
| 2022 | 53 | 50 |
| 2023 | 53 | 69 |
| 2024 | 52 | 39 |
| 2025 | 39 | 33 |
| 2026 | 27 | 21 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H03H 9/1071The enclosure being defined by a frame built on a substrate and491
- H03H 9/1092The enclosure being defined by a cover cap mounted on an element296
- H03H 9/1085The enclosure being defined by a non-uniform sealing mass covering the non-active200
- H03H 9/1078The enclosure being defined by a foil covering the non-active sides of63
Recent patents
- Surface acoustic wave device6 Oct 2026US 12,756,375 B2United Microelectronics Corp.
- Bulk acoustic wave device packaging with redistribution using silicon dioxide insulation25 Aug 2026US 12,719,440 B2Skyworks Solutions, Inc.
- Packaged acoustic wave devices with multilayer piezoelectric substrate18 Aug 2026US 12,712,519 B2Skyworks Solutions, Inc.
- Packaged acoustic wave devices with multi-layer piezoelectric substrate with seal ring spaced from piezoelectric layers14 Jul 2026US 12,683,577 B2Skyworks Solutions, Inc.
- Acoustic wave device with multilayer piezoelectric substrate for reduced spurious signals16 Jun 2026US 12,658,878 B2Skyworks Solutions, Inc.
- Packaged acoustic wave devices with multi-layer piezoelectric substrate with seal ring spaced from piezoelectric layers8 Oct 2026US 2026/0312563 A1Skyworks Solutions, Inc.
- Acoustic wave device1 Oct 2026US 2026/0303061 A1Murata Manufacturing Co., Ltd.
- Acoustic wave device with multilayer piezoelectric substrate for reduced spurious signals17 Sep 2026US 2026/0280514 A1Skyworks Solutions, Inc.
- Multilayer piezoelectric substrate device with negative temperature coefficient of frequency dielectric film for temperature stability17 Sep 2026US 2026/0280528 A1Skyworks Solutions, Inc.
- Packaged surface acoustic wave device with conductive roof supporting structure20 Aug 2026US 2026/0246449 A1Skyworks Solutions, Inc.
Most cited
By later US patents
- Surface acoustic wave device mounted module473US 5,459,368 AMatsushita Electric Industrial Co., Ltd. · 1995
- Electronic part and a method of production thereof357US 5,920,142 AMatsushita Electric Industrial Co., Ltd. · 1999
- Surface acoustic wave devices having a guard layer350US 5,699,027 AMatsushita Electric Industrial Co., Ltd. · 1997
- Encapsulated electronics device with improved heat dissipation310US 6,992,400 B2Epcos AG · 2006
- Encapsulation for electronic components and method for producing the encapsulation302US 5,831,369 ASiemens Matsushita Components GmbH & Co. KG · 1998