Packaged surface acoustic wave device with conductive roof supporting structure

A packaged surface acoustic wave device comprising:

• at least one conductive via that extends through a support substrate and a piezoelectric layer;
• at least one interdigital transducer electrode over the piezoelectric layer;
• a roof structure over the at least one interdigital transducer electrode;
• and
• at least one conductive pillar supporting the roof structure, a maximum horizontal dimension of the at least one conductive pillar being greater than a maximum horizontal dimension of the at least one conductive via.

A packaged surface acoustic wave device comprising:

• at least one conductive via that extends through a multilayer piezoelectric substrate, the multilayer piezoelectric substrate including a support substrate and a piezoelectric layer over the support substrate;
• at least one interdigital transducer electrode over the piezoelectric layer;
• a roof structure over the at least one interdigital transducer electrode;
• and
• at least one conductive support structure disposed between the multilayer piezoelectric substrate and the roof structure, the at least one conductive support structure supporting the roof structure, a maximum horizontal dimension of the at least one conductive support structure being greater than a maximum horizontal dimension of the at least one conductive via.