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US 12,756,375 B2Granted
Surface acoustic wave device
AssigneeUnited Microelectronics Corp.
InventorsChen-Hsiao Wang, Kai-Kuang Ho
Life of this patent
Estimating the term…
Abstract
A surface acoustic wave (SAW) device including a substrate is provided. Multiple surface acoustic wave elements are disposed on the substrate. A conductive surrounding structure includes: a wall part, disposed on the substrate and surrounding the surface acoustic wave elements; and a lateral layer part, disposed on the wall part. The lateral layer part has an opening above the surface acoustic wave elements. A cap layer covers the lateral layer part and closes the opening.
Claims11
A surface acoustic wave device, comprising:
- a substrate;
- a plurality of surface acoustic wave members, disposed on the substrate;
- a conductive surrounding structure, comprising:
- a wall part, disposed on the substrate and surrounding the surface acoustic wave members;
- and
- a lateral layer part, disposed on the wall part, wherein the lateral layer part comprises an opening above the surface acoustic wave members;
- and
- a cap layer, adapted to cover the lateral layer part and close the opening.
5 more elements
Dependencies are inferred from the claim text.