Bulk acoustic wave device packaging with redistribution using silicon dioxide insulation

An electronic device package comprising:

• a base substrate having an upper surface and a lower surface;
• an electrical device disposed on the upper surface of the base substrate;
• a conductive column in electrical communication with the electrical device and having a first end bonded to the upper surface of the base substrate;
• a cap substrate disposed over the electrical device and having a lower surface bonded to a second end of the conductive column;
• a layer of dielectric material having an upper surface disposed on the lower surface of the base substrate;
• a through substrate via in electrical communication with the conductive column and passing through the base substrate and the layer of dielectric material;
• a redistribution layer disposed on a lower surface of the layer of dielectric material;
• and
• a contact pad formed on a lower surface of the redistribution layer and in electrical communication with the through substrate via through the redistribution layer, the contact pad being horizontally displaced from a position directly below the through substrate via, to improve flexibility for mounting the electronic device package on an electronics module.