H03H 9/1078
The enclosure being defined by a foil covering the non-active sides of
Official title: {the enclosure being defined by a foil covering the non-active sides of the SAW device}
H03H9/1078 (The enclosure being defined by a foil covering the non-active sides of) appears on 63 US grants and 71 published applications in this corpus.
Search patents in H03H- Granted patents
- 63
- Published applications
- 71
- Assignees
- 38
- Inventors
- 140
- Latest grant
- 24 Oct 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2000 | 2 | 0 |
| 2001 | 2 | 2 |
| 2002 | 0 | 2 |
| 2003 | 6 | 3 |
| 2004 | 1 | 9 |
| 2005 | 4 | 9 |
| 2006 | 7 | 13 |
| 2007 | 5 | 5 |
| 2008 | 6 | 2 |
| 2009 | 4 | 2 |
| 2010 | 3 | 3 |
| 2011 | 1 | 0 |
| 2012 | 2 | 1 |
| 2013 | 1 | 4 |
| 2014 | 2 | 2 |
| 2015 | 2 | 0 |
| 2016 | 3 | 2 |
| 2017 | 1 | 1 |
| 2018 | 2 | 0 |
| 2019 | 0 | 3 |
| 2020 | 1 | 4 |
| 2021 | 0 | 1 |
| 2022 | 4 | 1 |
| 2023 | 4 | 0 |
| 2024 | 0 | 0 |
| 2025 | 0 | 2 |
By publication year. Applications have been published since 2001.
Recent patents
- Manufacturing method of mounting structure, and laminate sheet therefor24 Oct 2023US 11,799,442 B2Nagase Chemtex Corporation
- Elastic wave device and electronic component19 Sep 2023US 11,764,753 B2Murata Manufacturing Co., Ltd.
- Manufacturing method of mounting structure, and sheet therefor25 Jul 2023US 11,710,645 B2Nagase Chemtex Corporation
- Chip packaging method and particle chips28 Mar 2023US 11,616,044 B2Shenzhen Newsonic Technologies Co., Ltd.
- Manufacturing method of mounting structure, and sheet therefor9 Aug 2022US 11,410,898 B2Nagase Chemtex Corporation
- Surface Acoustic Wave Filter Module Packaging Structure And Packaging Method Thereof28 Aug 2025US 2025/0274102 A1Aac Acoustic Technologies (Shenzhen) Co., Ltd.
- Surface Acoustic Wave Filter Module Packaging Structure And Packaging Method Thereof28 Aug 2025US 2025/0274103 A1Aac Acoustic Technologies (Shenzhen) Co., Ltd.
- Chip packaging method and particle chips21 Jul 2022US 2022/0230987 A1Newsonic Technologies
- Manufacturing method of mounting structure, and sheet therefor18 Mar 2021US 2021/0084775 A1Nagase Chemtex Corporation
- Manufacturing method of mounting structure10 Dec 2020US 2020/0388509 A1Nagase Chemtex Corporation
Most cited
By later US patents
- Encapsulated electronics device with improved heat dissipation310US 6,992,400 B2Epcos AG · 2006
- Surface acoustic wave device mounted with a resin film and method of making same106US 6,078,229 ANEC Corporation · 2000
- Electronic component and method of production thereof89US 6,262,513 B1Kabushiki Kaisha Toshiba · 2001
- Methods for integrated circuit module packaging and integrated circuit module packages64US 7,445,968 B2SiGe Semiconductor (U.S.), Corp. · 2008
- Method for the hermetic encapsulation of a component54US 7,259,041 B2Epcos AG · 2007