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US 6,078,229 AGranted
Surface acoustic wave device mounted with a resin film and method of making same
AssigneeNEC Corporation
InventorsYoshitsugu Funada, Michinobu Tanioka
Life of this patent
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AssigneeNEC Corporation
InventorsYoshitsugu Funada, Michinobu Tanioka
Estimating the term…
It is an object on the invention to provide a SAW device sealed by resin, which is low priced and suited for decreasing its thickness and weight and requires no particular course for processing a substrate, and a method for fabricating the same. A functional surface of a piezoelectric substrate provided with interdigtal transducers and a mounting surface of a circuit substrate are opposed to each other to form vibration cavities for surface wave propagation areas therebetween. Electrical power is supplied to the piezoelectric substrate from the circuit substrate via electrode pads formed on respective inner surface of both the substrate and bumps inserted therebetween. A resin film adheres to the respective inner surfaces of both the substrates except the surface wave propagation areas to shield the vibration cavity from the environmental space. Apertures are previously formed at predetermined parts of the resin film by means of a laser. A resin film is temporarily adhered to the inner surface of the circuit substrate for instance, and positioning of both the substrates are adjusted relative to each other. Thereafter, both the substrates are permanently adhered to each other by hot-pressing them, and sealing is completed.
A surface acoustic wave device, comprising:
A method for fabricating a surface acoustic wave device, which comprises a piezoelectric substrate provided with interdigital transducers and surface wave propagation areas, both being formed on a functional surface of said piezoelectric substrate, and a circuit substrate having a mounting surface thereon, and are formed by combining said piezoelectric substrate with said circuit substrate, making said functional surface of said piezoelectric substrate oppose to said mounting surface of said circuit substrate, to form vibration cavities over said surface wave propagation areas, and provided with means for supplying electrical power to said interdigital transducers from said circuit substrate, comprising the steps of:
A method for fabricating a surface acoustic wave device, which comprises a piezoelectric substrate provided with interdigital transducers and surface wave propagation areas, both being formed on a functional surface of said piezoelectric substrate, and a circuit substrate having a mounting surface thereon, and are formed by combining said piezoelectric substrate with said circuit substrate, making said functional surface of said piezoelectric substrate oppose to said mounting surface of said circuit substrate, to form vibration cavities over said surface wave propagation areas, and provided with means for supplying electrical power to said interdigital transducers from said circuit substrate, comprising the steps of:
A method for fabricating a surface acoustic wave device, which comprises a piezoelectric substrate provided with interdigital transducers and surface wave propagation areas, both being formed on a functional surface of said piezoelectric substrate, and a circuit substrate having a mounting surface thereon, and are formed by combining said piezoelectric substrate with said circuit substrate, making said functional surface of said piezoelectric substrate oppose to said mounting surface of said circuit substrate, to form vibration cavities over said surface wave propagation areas, and provided with means for supplying electrical power to said interdigital transducers from said circuit substrate, comprising the steps of:
Dependencies are inferred from the claim text.