Chip packaging method and particle chips

A method for packaging chips, comprising:

• providing a filter wafer and a plurality of substrates to be packaged, each substrate of the plurality of substrates to be packaged being provided with one or more first pads;
• flip-chip bonding the plurality of substrates to be packaged on the filter wafer;
• molding the plurality of substrates to be packaged to form a molded layer on the plurality of substrates to be packaged, wherein the plurality of substrates to be packaged, the molded layer, and the filter wafer together form a molded structure, and each substrate to be packaged, a portion of the molded layer formed on the substrate to be packaged, and the filter wafer together enclose a cavity;
• exposing the one or more first pads out of the molded layer;
• and
• cutting the molded structure into a plurality of particle chips,
• wherein exposing the one or more first pads out of the molded layer comprises:
• thinning the molded layer to expose the one or more first pads out of the molded layer.