Encapsulated electronics device with improved heat dissipation

An encapsulated electronic device, comprising:

• a carrier having a first surface and an opposing second surface;
• a plurality of electrically conductive bumps disposed on the first surface;
• a plurality of electrically conductive segments disposed on the second surface;
• a plurality of electrically conductive paths, provided between the first and second surfaces of the carrier, for electrically connecting the bumps to the electrically conductive segments on the second surface;
• a die having a first surface and a second surface, the die disposed on top of the bumps, electrically connecting the first surface of the die to the electrical conductive segments on the second surface of the carrier through the electrically conductive paths and the bumps, wherein the second surface of the die has an inner area and an outer area surrounding the inner area;
• a laminate provided at least on the outer area of the second surface of the die and at least a part of the first surface of the carrier;
• and
• a hermetic seal layer covering the laminate, the inner area of the second surface of the die, and another part of the first surface of the carrier, wherein the hermetic seal layer comprises a thermally conductive layer, such that at least part of the hermetic seal layer is in contact with the inner area of the second surface of the die.