H03H 9/10
Mounting in enclosures
Official title: Mounting in enclosures {(constructional combinations of enclosure with electromechanical and other electronic elements H03H9/0538)}
H03H9/10 (Mounting in enclosures) appears on 2,713 US grants and 2,957 published applications in this corpus.
Search patents in H03H- Granted patents
- 2,713
- Published applications
- 2,957
- Assignees
- 377
- Inventors
- 3,033
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 7 | 0 |
| 1978 | 3 | 0 |
| 1979 | 2 | 0 |
| 1980 | 6 | 0 |
| 1981 | 7 | 0 |
| 1982 | 7 | 0 |
| 1983 | 9 | 0 |
| 1984 | 10 | 0 |
| 1985 | 5 | 0 |
| 1986 | 10 | 0 |
| 1987 | 15 | 0 |
| 1988 | 5 | 0 |
| 1989 | 2 | 0 |
| 1990 | 5 | 0 |
| 1991 | 7 | 0 |
| 1992 | 5 | 0 |
| 1993 | 16 | 0 |
| 1994 | 11 | 0 |
| 1995 | 20 | 0 |
| 1996 | 28 | 0 |
| 1997 | 27 | 0 |
| 1998 | 31 | 0 |
| 1999 | 45 | 0 |
| 2000 | 47 | 0 |
| 2001 | 32 | 23 |
| 2002 | 48 | 57 |
| 2003 | 46 | 49 |
| 2004 | 44 | 92 |
| 2005 | 53 | 87 |
| 2006 | 64 | 83 |
| 2007 | 67 | 84 |
| 2008 | 51 | 68 |
| 2009 | 74 | 93 |
| 2010 | 55 | 116 |
| 2011 | 89 | 179 |
| 2012 | 106 | 137 |
| 2013 | 122 | 124 |
| 2014 | 106 | 116 |
| 2015 | 114 | 105 |
| 2016 | 88 | 97 |
| 2017 | 85 | 128 |
| 2018 | 86 | 176 |
| 2019 | 131 | 159 |
| 2020 | 158 | 189 |
| 2021 | 128 | 146 |
| 2022 | 140 | 172 |
| 2023 | 153 | 183 |
| 2024 | 142 | 132 |
| 2025 | 116 | 104 |
| 2026 | 84 | 58 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- MEMS resonator6 Oct 2026US 12,753,070 B2SiTime Corporation
- Surface acoustic wave device6 Oct 2026US 12,756,375 B2United Microelectronics Corp.
- Vibrator device with semiconductor element and vibrator22 Sep 2026US 12,744,510 B2Seiko Epson Corporation
- Antenna filter and electronic device comprising same in wireless communication system22 Sep 2026US 12,744,556 B2Samsung Electronics Co., Ltd.
- Piezoelectric acoustic resonator with dielectric protective layer manufactured with piezoelectric thin film transfer process15 Sep 2026US 12,738,916 B2Akoustis Technologies Corp.
- Packaged acoustic wave devices with multi-layer piezoelectric substrate with seal ring spaced from piezoelectric layers8 Oct 2026US 2026/0312563 A1Skyworks Solutions, Inc.
- Stress isolated bulk acoustic wave resonator dies1 Oct 2026US 2026/0303056 A1
- Acoustic wave device1 Oct 2026US 2026/0303061 A1Murata Manufacturing Co., Ltd.
- Acoustic wave device with multilayer piezoelectric substrate for reduced spurious signals17 Sep 2026US 2026/0280514 A1Skyworks Solutions, Inc.
- Multilayer piezoelectric substrate device with negative temperature coefficient of frequency dielectric film for temperature stability17 Sep 2026US 2026/0280528 A1Skyworks Solutions, Inc.
Most cited
By later US patents
- Surface acoustic wave device mounted module473US 5,459,368 AMatsushita Electric Industrial Co., Ltd. · 1995
- Electronic part and a method of production thereof357US 5,920,142 AMatsushita Electric Industrial Co., Ltd. · 1999
- Surface acoustic wave devices having a guard layer350US 5,699,027 AMatsushita Electric Industrial Co., Ltd. · 1997
- Encapsulated electronics device with improved heat dissipation310US 6,992,400 B2Epcos AG · 2006
- Encapsulation for electronic components and method for producing the encapsulation302US 5,831,369 ASiemens Matsushita Components GmbH & Co. KG · 1998