H03H 9/1007
For bulk acoustic wave [baw] devices
Official title: {for bulk acoustic wave [BAW] devices}
H03H9/1007 (For bulk acoustic wave [baw] devices) appears on 1,825 US grants and 2,016 published applications in this corpus.
Search patents in H03H- Granted patents
- 1,825
- Published applications
- 2,016
- Assignees
- 253
- Inventors
- 2,085
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 6 | 0 |
| 1978 | 3 | 0 |
| 1979 | 2 | 0 |
| 1980 | 4 | 0 |
| 1981 | 5 | 0 |
| 1982 | 7 | 0 |
| 1983 | 7 | 0 |
| 1984 | 9 | 0 |
| 1985 | 5 | 0 |
| 1986 | 8 | 0 |
| 1987 | 13 | 0 |
| 1988 | 3 | 0 |
| 1989 | 1 | 0 |
| 1990 | 5 | 0 |
| 1991 | 3 | 0 |
| 1992 | 4 | 0 |
| 1993 | 13 | 0 |
| 1994 | 8 | 0 |
| 1995 | 11 | 0 |
| 1996 | 25 | 0 |
| 1997 | 22 | 0 |
| 1998 | 19 | 0 |
| 1999 | 31 | 0 |
| 2000 | 32 | 0 |
| 2001 | 14 | 11 |
| 2002 | 24 | 30 |
| 2003 | 26 | 25 |
| 2004 | 26 | 43 |
| 2005 | 25 | 38 |
| 2006 | 34 | 33 |
| 2007 | 27 | 52 |
| 2008 | 26 | 45 |
| 2009 | 44 | 74 |
| 2010 | 37 | 89 |
| 2011 | 63 | 153 |
| 2012 | 87 | 113 |
| 2013 | 96 | 98 |
| 2014 | 80 | 78 |
| 2015 | 85 | 76 |
| 2016 | 49 | 60 |
| 2017 | 62 | 84 |
| 2018 | 58 | 112 |
| 2019 | 79 | 116 |
| 2020 | 97 | 130 |
| 2021 | 98 | 108 |
| 2022 | 101 | 130 |
| 2023 | 99 | 120 |
| 2024 | 110 | 97 |
| 2025 | 80 | 70 |
| 2026 | 51 | 31 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H03H 9/1014The enclosure being defined by a frame built on a substrate and1,349
- H03H 9/1035The enclosure being defined by two sealing substrates sandwiching the piezoelectric layer308
- H03H 9/105The enclosure being defined by a cover cap mounted on an element190
- H03H 9/1042The enclosure being defined by a housing formed by a cavity in61
Recent patents
- Vibrator device with semiconductor element and vibrator22 Sep 2026US 12,744,510 B2Seiko Epson Corporation
- Antenna filter and electronic device comprising same in wireless communication system22 Sep 2026US 12,744,556 B2Samsung Electronics Co., Ltd.
- Piezoelectric acoustic resonator with dielectric protective layer manufactured with piezoelectric thin film transfer process15 Sep 2026US 12,738,916 B2Akoustis Technologies Corp.
- Piezoelectric resonator device25 Aug 2026US 12,719,437 B2Daishinku Corporation
- Bulk acoustic wave device packaging with redistribution using silicon dioxide insulation25 Aug 2026US 12,719,440 B2Skyworks Solutions, Inc.
- Stress isolated bulk acoustic wave resonator dies1 Oct 2026US 2026/0303056 A1
- Methods of forming group iii piezoelectric thin films via removal of portions of first sputtered material27 Aug 2026US 2026/0255878 A1Akoustis Technologies Corp.
- Piezoelectric resonator plate and piezoelectric resonator device13 Aug 2026US 2026/0238187 A1Daishinku Corporation
- Resonator element and resonator device13 Aug 2026US 2026/0238188 A1Seiko Epson Corporation
- Resonator device6 Aug 2026US 2026/0230058 A1Seiko Epson Corporation
Most cited
By later US patents
- Electronic part and a method of production thereof357US 5,920,142 AMatsushita Electric Industrial Co., Ltd. · 1999
- Method for producing a cover, method for producing a packaged device282US 7,288,435 B2Infineon Technologies AG · 2007
- Method for producing an electronic component using direct bonding273US 5,771,555 AMatsushita Electric Industrial Co., Ltd. · 1998
- Acoustic resonator filter with reduced electromagnetic influence due to die substrate thickness193US 6,377,137 B1Agilent Technologies, Inc. · 2002
- Lamb wave type frequency device and method thereof183US 7,728,483 B2Seiko Epson Corporation · 2010