H03H 9/105
The enclosure being defined by a cover cap mounted on an element
Official title: {the enclosure being defined by a cover cap mounted on an element forming part of the BAW device}
H03H9/105 (The enclosure being defined by a cover cap mounted on an element) appears on 190 US grants and 277 published applications in this corpus.
Search patents in H03H- Granted patents
- 190
- Published applications
- 277
- Assignees
- 71
- Inventors
- 436
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2001 | 1 | 1 |
| 2002 | 0 | 4 |
| 2003 | 1 | 3 |
| 2004 | 4 | 9 |
| 2005 | 4 | 11 |
| 2006 | 4 | 5 |
| 2007 | 8 | 12 |
| 2008 | 4 | 7 |
| 2009 | 8 | 2 |
| 2010 | 2 | 9 |
| 2011 | 3 | 2 |
| 2012 | 5 | 5 |
| 2013 | 4 | 6 |
| 2014 | 3 | 5 |
| 2015 | 2 | 4 |
| 2016 | 2 | 1 |
| 2017 | 8 | 6 |
| 2018 | 4 | 9 |
| 2019 | 6 | 12 |
| 2020 | 10 | 21 |
| 2021 | 11 | 25 |
| 2022 | 17 | 34 |
| 2023 | 20 | 30 |
| 2024 | 33 | 24 |
| 2025 | 14 | 20 |
| 2026 | 12 | 10 |
By publication year. 2026 runs to 8 Oct.
Recent patents
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- Acoustic wave filter device and method of manufacturing acoustic wave filter device23 Jul 2026US 2026/0213730 A1Murata Manufacturing Co., Ltd.
- Piezoelectric acoustic resonator with improved tcf manufactured with piezoelectric thin film transfer process25 Jun 2026US 2026/0180537 A1Akoustis Technologies Corp.
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Most cited
By later US patents
- Method for producing a cover, method for producing a packaged device282US 7,288,435 B2Infineon Technologies AG · 2007
- Methods for producing packaged integrated circuit devices & packaged integrated circuit devices produced thereby157US 6,777,767 B2Shellcase Ltd. · 2004
- Transversely-excited film bulk acoustic resonator package and method146US 10,819,309 B1Resonant Inc. · 2020
- Electronic device with cavity and a method for producing the same112US 7,268,436 B2Infineon Technologies AG · 2007
- Electronic component having micro-electrical mechanical system100US 7,053,456 B2Kabushiki Kaisha Toshiba · 2006