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US 12,700,848 B2Granted
Self-shielded acoustic wave device package
AssigneeSkyworks Solutions, Inc.
InventorsAtsushi Takano, Mitsuhiro Furukawa, Takeshi Furusawa
Life of this patent
Estimating the term…
Abstract
A packaged acoustic wave component has an acoustic wave device mounted on a device substrate and a cap substrate spaced above the device substrate. The packaged acoustic wave component also has a shield structure including a metal plate disposed on a bottom surface of the cap substrate that faces the device substrate, the metal plate being spaced above the acoustic wave device, and a peripheral metal wall attached to the metal plate that extends to the device substrate. The shield structure encloses and electrically shields the acoustic wave device.
Claims20
A packaged acoustic wave component comprising:
- an acoustic wave device mounted on a device substrate;
- a planar cap substrate spaced above the device substrate;
- and
- a shield structure including a metal plate disposed on a bottom surface of the planar cap substrate that faces the device substrate, an entirety of the planar cap substrate being axially above the metal plate, the metal plate being spaced above the acoustic wave device, and the shield structure further including a peripheral metal wall attached to the metal plate that extends from the metal plate to the device substrate, at least a portion of the peripheral metal wall being a monolithic, seamless piece with, and of a same material as, the metal plate, the at least a portion of the peripheral metal wall and the metal plate being made with a process for making the planar cap substrate, the peripheral metal wall attached to the device substrate, a cavity between the device substrate and the metal plate and bounded by the peripheral metal wall being under vacuum, the shield structure enclosing and electrically shielding the acoustic wave device.
1 more element
A radio frequency module comprising:
- a package substrate;
- a packaged acoustic wave component including an acoustic wave device mounted on a device substrate, a planar cap substrate spaced above the device substrate, and a shield structure including a metal plate disposed on a bottom surface of the planar cap substrate that faces the device substrate, an entirety of the planar cap substrate being axially above the metal plate, the metal plate being spaced above the acoustic wave device, and a peripheral metal wall attached to the metal plate that extends from the metal plate to the device substrate, at least a portion of the peripheral metal wall being a monolithic, seamless piece with, and of a same material as, the metal plate, the peripheral metal wall attached to the device substrate, the at least a portion of the peripheral metal wall and the metal plate being made with the process for making the planar cap substrate, a cavity between the device substrate and the metal plate and bounded by the peripheral metal wall being under vacuum, the shield structure enclosing and electrically shielding the acoustic wave device;
- and
- additional circuitry, the packaged acoustic wave component and additional circuitry disposed on the package substrate.
1 more element
A wireless communication device comprising:
- an antenna;
- and
- a front end module including one or more packaged acoustic wave components configured to filter a radio frequency signal associated with the antenna, each packaged acoustic wave component including an acoustic wave device mounted on a device substrate, a planar cap substrate spaced above the device substrate, and a shield structure including a metal plate disposed on a bottom surface of the planar cap substrate that faces the device substrate, an entirety of the planar cap substrate being axially above the metal plate, the metal plate being spaced above the acoustic wave device, and a peripheral metal wall attached to the metal plate that extends from the metal plate to the device substrate, at least a portion of the peripheral metal wall being a monolithic, seamless piece with, and of a same material as, the metal plate, the peripheral metal wall attached to the device substrate, the at least a portion of the peripheral metal wall and the metal plate being made with the process for making the planar cap substrate, a cavity between the device substrate and the metal plate and bounded by the peripheral metal wall being under vacuum, the shield structure enclosing and electrically shielding the acoustic wave device.
Dependencies are inferred from the claim text.