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US 7,728,483 B2Granted
Lamb wave type frequency device and method thereof
AssigneeSeiko Epson Corporation
InventorSatoru Tanaka
Life of this patent
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Abstract
A Lamb wave type high frequency device comprises: a piezoelectric substrate; an interdigital transducer (IDT) electrode formed on a first main surface of the piezoelectric substrates a reinforcing substrate connected to a second main surface of the piezoelectric substrate; a space portion formed in one of the piezoelectric substrate and the reinforcing substrate, an area of the space portion being larger than a region in which a Lamb wave is propagated; and a connecting surface formed in a periphery of the space portion.
Claims4
A Lamb wave type high frequency device, comprising:
- a piezoelectric substrate;
- an interdigital transducer (IDT) electrode formed on a first main surface of the piezoelectric substrate;
- a reinforcing substrate connected to a second main surface of the piezoelectric substrate;
- a space portion formed in one of the piezoelectric substrate and the reinforcing substrate, an area of the space portion being larger than a region in which a Lamb wave is propagated, the space portion being formed by a groove-like recess arranged in one of the piezoelectric substrate and the reinforcing substrate, and an opening of the space portion being arranged in a pair of opposite side surfaces of the one of the piezoelectric substrate and the reinforcing substrate;
- and
- a connecting surface formed in a periphery of the space portion.
3 more elements
A Lamb wave type high frequency device, comprising:
- a piezoelectric substrate;
- an interdigital transducer (IDT) electrode formed on a first main surface of the piezoelectric substrate;
- a reinforcing substrate connected to a second main surface of the piezoelectric substrate;
- a space portion formed in one of the piezoelectric substrate and the reinforcing substrate, an area of the space portion being larger than a region in which a Lamb wave is propagated, the space portion being formed by a groove-like recess arranged in one of the piezoelectric substrate and the reinforcing substrate, and an opening of the space portion being arranged in a pair of opposite side surfaces of the one of the piezoelectric substrate and the reinforcing substrate;
- a connecting surface formed in a periphery of the space portion;
- and
- a package having a case and a lid and air-tightly sealing the piezoelectric substrate and the reinforcing substrate.
4 more elements
Dependencies are inferred from the claim text.