Vibrator device with semiconductor element and vibrator

A vibrator device comprising:

• a base;
• a semiconductor element flip-chip mounted on the base;
• a vibrator mounted on the semiconductor element via an adhesive;
• a first coupling wire formed on the base;
• a first bump electrically coupling the semiconductor element and the first coupling wire;
• a first wire electrically coupling the first coupling wire and the vibrator;
• and
• a mold portion placed on the base and covering the semiconductor element and the vibrator, wherein
• an external output terminal is formed on the base,
• the semiconductor element is electrically coupled to the external output terminal,
• the vibrator has a first excitation electrode, and
• the first coupling wire and the first excitation electrode are electrically coupled via the first wire, wherein
• the semiconductor element is mounted on the base via a second bump and a third bump,
• a second coupling wire and a third coupling wire are formed on the base,
• the semiconductor element is electrically coupled to the second coupling wire via the second bump and electrically coupled to the third coupling wire via the third bump,
• the vibrator has a second excitation electrode,
• the second coupling wire and the second excitation electrode are electrically coupled via a second wire,
• the third coupling wire is electrically coupled to the external output terminal, and
• in a plan view, the first coupling wire and the second coupling wire are placed at one side of the vibrator and the third coupling wire is placed at the other side of the vibrator.