Method for producing an electronic component using direct bonding

A method for producing an electronic component, comprising the steps of:

• patterning a single crystalline substrate;
• forming a first patterned conductive layer over a first surface of the single crystalline substrate;
• forming a second patterned conductive layer over a second surface of the single crystalline substrate, wherein the first and second patterned conductive layers correspond to one another at an oscillating portion of the electronic component, and wherein the first and second patterned conductive layers do not correspond to one another at a terminal electrode portion of the electronic component, thereby preventing the terminal electrode portion of the electronic component from adversely impacting the oscillation of the oscillation portion of the electronic component;
• forming a first patterned insulating layer over the first patterned conductive layer and the first surface of the single crystalline substrate;
• forming a second patterned insulating layer over the second patterned conductive layer and the second surface of the single crystalline substrate;
• direct bonding a first holding substrate to the first patterned insulating layer;
• and
• direct bonding a second holding substrate to the second patterned insulating layer,
• wherein the first and second holding substrates enclose the electronic component, thereby hermetically sealing the electronic component.