H03H 9/1035
The enclosure being defined by two sealing substrates sandwiching the piezoelectric layer
Official title: {the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device}
H03H9/1035 (The enclosure being defined by two sealing substrates sandwiching the piezoelectric layer) appears on 308 US grants and 307 published applications in this corpus.
Search patents in H03H- Granted patents
- 308
- Published applications
- 307
- Assignees
- 60
- Inventors
- 351
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 3 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 5 | 0 |
| 1995 | 3 | 0 |
| 1996 | 7 | 0 |
| 1997 | 10 | 0 |
| 1998 | 5 | 0 |
| 1999 | 4 | 0 |
| 2000 | 9 | 0 |
| 2001 | 7 | 5 |
| 2002 | 10 | 8 |
| 2003 | 9 | 5 |
| 2004 | 4 | 3 |
| 2005 | 4 | 1 |
| 2006 | 3 | 6 |
| 2007 | 2 | 4 |
| 2008 | 3 | 5 |
| 2009 | 8 | 14 |
| 2010 | 7 | 19 |
| 2011 | 6 | 27 |
| 2012 | 18 | 23 |
| 2013 | 20 | 23 |
| 2014 | 20 | 7 |
| 2015 | 12 | 5 |
| 2016 | 4 | 2 |
| 2017 | 4 | 4 |
| 2018 | 5 | 19 |
| 2019 | 3 | 15 |
| 2020 | 13 | 21 |
| 2021 | 15 | 15 |
| 2022 | 21 | 22 |
| 2023 | 15 | 20 |
| 2024 | 19 | 17 |
| 2025 | 12 | 12 |
| 2026 | 6 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Piezoelectric resonator device25 Aug 2026US 12,719,437 B2Daishinku Corporation
- Film bulk acoustic resonator structure and fabricating method19 May 2026US 12,633,900 B2Shenzhen Newsonic Technologies Co., Ltd.
- Piezoelectric vibration device and manufacturing method therefor14 Apr 2026US 12,603,637 B2Daishinku Corporation
- Acoustic wave device and manufacturing method for acoustic wave device3 Mar 2026US 12,567,850 B2Murata Manufacturing Co., Ltd.
- Piezoelectric vibration plate, piezoelectric vibration device, and manufacturing method for piezoelectric vibration device3 Mar 2026US 12,567,852 B2Daishinku Corporation
- Piezoelectric resonator plate and piezoelectric resonator device13 Aug 2026US 2026/0238187 A1Daishinku Corporation
- Resonator element and resonator device13 Aug 2026US 2026/0238188 A1Seiko Epson Corporation
- Vibration device and method for manufacturing vibration device12 Mar 2026US 2026/0074672 A1KYOCERA Corporation
- Crystal resonator plate and crystal resonator device29 Jan 2026US 2026/0031785 A1Daishinku Corporation
- Piezoelectric resonator unit15 Jan 2026US 2026/0019062 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Method for producing an electronic component using direct bonding273US 5,771,555 AMatsushita Electric Industrial Co., Ltd. · 1998
- Transversely-excited film bulk acoustic resonator package and method146US 10,819,309 B1Resonant Inc. · 2020
- Micro-machined resonator oscillator76US 5,339,051 ASandia Corporation · 1994
- Micro-machined resonator64US 5,198,716 AThe United States of America as represented by the United States Department of Energy · 1993
- Crystal oscillator64US 5,596,243 AMatsushita Electric Industrial Co., Ltd. · 1997