H03H 9/1042
The enclosure being defined by a housing formed by a cavity in
Official title: {the enclosure being defined by a housing formed by a cavity in a resin}
H03H9/1042 (The enclosure being defined by a housing formed by a cavity in) appears on 61 US grants and 70 published applications in this corpus.
Search patents in H03H- Granted patents
- 61
- Published applications
- 70
- Assignees
- 32
- Inventors
- 164
- Latest grant
- 5 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 1 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 2 |
| 2011 | 0 | 0 |
| 2012 | 1 | 1 |
| 2013 | 1 | 3 |
| 2014 | 1 | 0 |
| 2015 | 1 | 0 |
| 2016 | 0 | 4 |
| 2017 | 0 | 1 |
| 2018 | 2 | 4 |
| 2019 | 6 | 11 |
| 2020 | 4 | 6 |
| 2021 | 3 | 5 |
| 2022 | 5 | 10 |
| 2023 | 6 | 8 |
| 2024 | 9 | 7 |
| 2025 | 3 | 4 |
| 2026 | 4 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Integrated devices with multiple acoustic resonator chiplets5 May 2026US 12,620,970 B2QUALCOMM Incorporated
- Electronic circuit module5 May 2026US 12,622,299 B2Murata Manufacturing Co., Ltd.
- Acoustic wave device and method of manufacturing acoustic wave device3 Mar 2026US 12,567,849 B2Murata Manufacturing Co., Ltd.
- Acoustic wave device27 Jan 2026US 12,537,506 B2Murata Manufacturing Co., Ltd.
- High frequency module and communication apparatus17 Jun 2025US 12,334,898 B2Murata Manufacturing Co., Ltd.
- Stress isolated bulk acoustic wave resonator dies1 Oct 2026US 2026/0303056 A1
- Integrated devices with multiple acoustic resonator chiplets30 Jul 2026US 2026/0221955 A1QUALCOMM Incorporated
- Cavity filter system-in-package module, electronic product, and preparation method19 Mar 2026US 2026/0082962 A1Vanchip (Tianjin) Technology Co., Ltd.
- Bulk acoustic wave filter5 Mar 2026US 2026/0066873 A1STMicroelectronics International N. V.
- Acoustic filter device including an acoustic filter and one or more integrated passive devices11 Dec 2025US 2025/0379557 A1QUALCOMM Incorporated
Most cited
By later US patents
- Electronic part and a method of production thereof357US 5,920,142 AMatsushita Electric Industrial Co., Ltd. · 1999
- Transversely-excited film bulk acoustic resonator package and method146US 10,819,309 B1Resonant Inc. · 2020
- Electronic part and a method of production thereof55US 6,154,940 AMatsushita Electric Industrial Co., Ltd. · 2000
- Method of fabricating novel packages for electronic components25US 10,797,681 B1Zhuhai Crystal Resonance Technologies Co., Ltd. · 2020
- Electronic component22US 5,166,570 AMurata Manufacturing Co., Ltd. · 1992