Cavity filter system-in-package module, electronic product, and preparation method

A preparation method of a cavity filter system-in-package module, comprising the following steps:

• S11:
• preparing a substrate having a groove, wherein the groove extends from an upper surface of the substrate toward an interior of the substrate down to or below a layer at which a second layer pattern is located;
• S12:
• preparing a first flip chip and a second flip device;
• S13:
• connecting a bump of the first flip chip to a second conductive circuit in the groove, and fixing the first flip chip in the groove;
• S14:
• soldering the second flip device to a second pad;
• S15:
• forming a solder mask layer on the upper surface of the substrate, wherein the solder mask layer surrounds the first flip chip and the second flip device;
• S16:
• covering the solder mask layer, the first flip chip, and the second flip device with a film layer through a film covering process;
• and
• S17:
• using a plastic sealing process to form a plastic encapsulant on the film layer.

A preparation method of a cavity filter system-in-package module, comprising the following steps:

• S21:
• preparing a substrate having a groove, wherein the groove extends from an upper surface of the substrate toward an interior of the substrate down to or below a layer at which a second layer pattern is located;
• S22:
• preparing a first flip chip and a second flip device;
• S23:
• connecting a bump of the first flip chip to a second conductive circuit in the groove, and fixing the first flip chip in the groove;
• S24:
• soldering the second flip device to a second pad;
• S25:
• forming a solder mask layer on the upper surface of the substrate, wherein the solder mask layer surrounds the first flip chip and the second flip device;
• S26:
• using a dispensing process to form a colloid between the first flip chip and the solder mask layer surrounding the first flip chip;
• and
• S27:
• using a plastic sealing process to form a plastic encapsulant.