Integrated devices with multiple acoustic resonator chiplets
AssigneeQUALCOMM Incorporated
InventorsJonghae KIM, Je-Hsiung LAN, Ranadeep DUTTA
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Abstract
A device includes a resonator stack. The resonator stack includes a first chiplet including a first acoustic resonator having a first resonant frequency and a second chiplet including a second acoustic resonator having a second resonant frequency that is different from the first resonant frequency. The device also includes a substrate coupled to the resonator stack, and electrical interconnections between the first chiplet and the second chiplet to provide a conductive path between the first acoustic resonator and the second acoustic resonator.
Claims30
A device comprising:
- a resonator stack comprising:
- a first chiplet including a first acoustic resonator having a first resonant frequency;
- and
- a second chiplet including a second acoustic resonator having a second resonant frequency that is different from the first resonant frequency;
- a substrate coupled to the resonator stack;
- and
- electrical interconnections between the first chiplet and the second chiplet to provide a conductive path between the first acoustic resonator and the second acoustic resonator.
A method of fabrication comprising:
- placing a first chiplet with a first acoustic resonator having a first resonant frequency on a substrate;
- placing a second chiplet with a second acoustic resonator having a second resonant frequency on the substrate;
- and
- electrically connecting the first chiplet and the second chiplet to provide a conductive path between the first acoustic resonator and the second acoustic resonator.
A device comprising:
- a resonator stack comprising:
- a first stack layer including:
- a first chiplet including a first acoustic resonator having a first resonant frequency;
- and
- a second chiplet including a second acoustic resonator having a second resonant frequency that is different from the first resonant frequency;
- a second stack layer including:
- a third chiplet including a third acoustic resonator having a third resonant frequency;
- and
- a fourth chiplet including a fourth acoustic resonator having a fourth resonant frequency that is different from the third resonant frequency;
- and
- mold compound at least partially encapsulating the first chiplet, the second chiplet, the third chiplet, the fourth chiplet, and a set of through-mold conductors;
- first electrical interconnections between the first chiplet and the second chiplet to provide a first conductive path between the first acoustic resonator and the second acoustic resonator;
- and
- second electrical interconnections between the third chiplet and the fourth chiplet to provide a second conductive path between the third acoustic resonator and the fourth acoustic resonator.
Dependencies are inferred from the claim text.