Acoustic wave device

An acoustic wave device comprising:

• a package substrate including a first principal surface and a second principal surface which are opposed to each other;
• an acoustic wave element at the first principal surface of the package substrate;
• a sealing resin layer at the first principal surface of the package substrate and covering at least a portion of the acoustic wave element;
• and
• a non-metallic shield film covering the sealing resin layer;
• wherein
• the package substrate includes a ground connection electrode in the package substrate, electrically connected to the acoustic wave element, and connected to a ground potential and a hot connection electrode in the package substrate, electrically connected to the acoustic wave element, and connected to a hot potential;
• the package substrate includes a side surface connected to the first principal surface and a connection portion connected to at least a portion of an end edge on a side with the second principal surface in the side surface and at least a portion of an outer peripheral edge in the second principal surface;
• and
• the connection portion is located inside a portion surrounded by an imaginary plane extended from the second principal surface and an imaginary plane extended from the side surface;
• and
• the shield film reaches the side surface of the package substrate and does not reach the connection portion, and the shield film is connected to at least one of the ground connection electrode and the hot connection electrode.