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US 5,831,369 AGranted
Encapsulation for electronic components and method for producing the encapsulation
AssigneeSiemens Matsushita Components GmbH & Co. KG
InventorsBruno Furbacher, Friedrich Lupp, Wolfgang Pahl, Gunter Trausch
Life of this patent
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Abstract
An encapsulation for SAW components and a method for producing the encapsulation use a cap to seal component structures on a substrate. The cap is in the form of a cover on the substrate and has cutouts which accommodate the component structures in regions of the component structures.
Claims12
In a component operating with surface acoustic waves (SAW component) and having a substrate and component structures on the substrate, an encapsulation for the component, comprising:
- a cap sealing the component structures on the substrate, said cap being formed by a cover on the substrate and said cover having cutouts formed therein in regions of the component structures for accommodating the component structures;
- said cover having an upright carrier surrounding the component structures on the substrate and a covering layer applied onto said carrier, said cover also including supports disposed on the substrate;
- and
- said carrier formed of a photoresist material.
1 more element
Dependencies are inferred from the claim text.