H03H 9/1092
The enclosure being defined by a cover cap mounted on an element
Official title: {the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's}
H03H9/1092 (The enclosure being defined by a cover cap mounted on an element) appears on 296 US grants and 316 published applications in this corpus.
Search patents in H03H- Granted patents
- 296
- Published applications
- 316
- Assignees
- 88
- Inventors
- 453
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 4 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 3 | 0 |
| 2000 | 4 | 0 |
| 2001 | 5 | 4 |
| 2002 | 4 | 4 |
| 2003 | 6 | 3 |
| 2004 | 4 | 9 |
| 2005 | 5 | 4 |
| 2006 | 4 | 12 |
| 2007 | 7 | 15 |
| 2008 | 9 | 11 |
| 2009 | 9 | 10 |
| 2010 | 8 | 16 |
| 2011 | 14 | 7 |
| 2012 | 13 | 10 |
| 2013 | 9 | 9 |
| 2014 | 5 | 14 |
| 2015 | 9 | 11 |
| 2016 | 13 | 9 |
| 2017 | 9 | 10 |
| 2018 | 14 | 14 |
| 2019 | 10 | 21 |
| 2020 | 13 | 31 |
| 2021 | 14 | 11 |
| 2022 | 14 | 14 |
| 2023 | 27 | 40 |
| 2024 | 17 | 12 |
| 2025 | 19 | 7 |
| 2026 | 10 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Surface acoustic wave device6 Oct 2026US 12,756,375 B2United Microelectronics Corp.
- Packaged acoustic wave devices with multilayer piezoelectric substrate18 Aug 2026US 12,712,519 B2Skyworks Solutions, Inc.
- Method of making packaged acoustic wave devices with multilayer piezoelectric substrate26 May 2026US 12,640,699 B2Skyworks Solutions, Inc.
- Piezoelectric device26 May 2026US 12,640,704 B2Murata Manufacturing Co., Ltd.
- Elastic wave device, module19 May 2026US 12,633,894 B2Sanan Japan Technology Corporation
- Acoustic wave device1 Oct 2026US 2026/0303061 A1Murata Manufacturing Co., Ltd.
- Packaged surface acoustic wave device with conductive roof supporting structure20 Aug 2026US 2026/0246449 A1Skyworks Solutions, Inc.
- Multi-band surface acoustic wave filters25 Jun 2026US 2026/0180551 A1Skyworks Solutions, Inc.
- Acoustic wave device and fabrication method thereof9 Apr 2026US 2026/0100690 A1RichWave Technology Corp.
- Multi-layer piezoelectric substrate2 Apr 2026US 2026/0095145 A1Skyworks Solutions, Inc.
Most cited
By later US patents
- Electronic part and a method of production thereof357US 5,920,142 AMatsushita Electric Industrial Co., Ltd. · 1999
- Encapsulation for electronic components and method for producing the encapsulation302US 5,831,369 ASiemens Matsushita Components GmbH & Co. KG · 1998
- Piezoelectric device and method for producing same295US 7,427,824 B2Murata Manufacturing Co., Ltd. · 2008
- Method of assembling a wafer-level package filter288US 7,596,849 B1TriQuint Semiconductor, Inc. · 2009
- Method for producing an encapsulation for a SAW component operating with surface acoustic waves287US 6,446,316 B1Siemens Matsushita Components GmbH & Co. KG · 2002