Elastic wave device, module
AssigneeSanan Japan Technology Corporation
InventorEiji Kuwahara
Life of this patent
Estimating the term…
Abstract
An elastic wave device includes a wiring board, a device chip having a resonator, and a wiring pattern electrically connected to the resonator, the device chip is electrically connected to the wiring board, and a sealing portion that seals the device chip. The wiring pattern includes a first wiring layer and a second wiring layer. The second wiring layer includes a lower metal layer in contact with an upper surface of the first wiring layer, a partition layer which is a metal layer in contact with an upper surface of the lower metal layer, and an upper metal layer in contact with an upper surface of the partition layer. The partition layer is a metal having a lower electrical conductivity than the lower metal layer and the upper metal layer.
Claims15
An elastic wave device, comprising:
- a wiring board;
- a device chip having a resonator, and a wiring pattern electrically connected to the resonator, wherein the device chip is electrically connected to the wiring board;
- and
- a sealing portion that seals the device chip, wherein the wiring pattern includes a first wiring layer and a second wiring layer, the second wiring layer includes a lower metal layer in contact with an upper surface of the first wiring layer,
- a partition layer which is a metal layer in contact with an upper surface of the lower metal layer, and an upper metal layer in contact with an upper surface of the partition layer,
- the partition layer is a metal having a lower electrical conductivity than the lower metal layer and the upper metal layer, and
- the second wiring layer has a stepped shape throughout its entire area.
An elastic wave device, comprising:
- a wiring board;
- a device chip having a resonator, and a wiring pattern electrically connected to the resonator, wherein the device chip is electrically connected to the wiring board;
- and
- a sealing portion that seals the device chip,
- wherein the wiring pattern includes a first wiring layer and a second wiring layer, the second wiring layer includes a lower metal layer in contact with an upper surface of the first wiring layer,
- a partition layer which is a metal layer in contact with an upper surface of the lower metal layer, and an upper metal layer in contact with an upper surface of the partition layer,
- the partition layer is a metal having a lower electrical conductivity than the lower metal layer and the upper metal layer,
- the first wiring layer has a structure in which a Ti layer, an AlCu layer and a Ti layer are stacked in the order presented, the lower metal layer has a structure in which a Ti layer and an Al layer are stacked in the order presented, the partition layer is made of Ti, and the upper metal layer is made of Al.
Dependencies are inferred from the claim text.