Back to results
US 2026/0095145 A1Published application
Multi-layer piezoelectric substrate
AssigneeSkyworks Solutions, Inc.
InventorCedric Olivier Gerald Poirel
Life of this patent
Estimating the term…
Abstract
An acoustic wave device includes a multi-layer piezoelectric substrate with an electrical interconnect extending through a piezoelectric layer and a dielectric layer. At least one electrical connection extends through a substrate layer and is electrically connected with the electrical interconnect.
Claims20
A multi-layer piezoelectric substrate comprising:
- a piezoelectric layer;
- at least one dielectric layer;
- at least one electrical interconnect extending through the piezoelectric layer and the at least one dielectric layer;
- and
- a substrate layer having at least one electrical connection extending through the substrate layer, the at least one electrical connection and the at least one electrical interconnect being electrically connected.
2 more elements
An acoustic device comprising:
- a multi-layer piezoelectric substrate including a piezoelectric layer, at least one dielectric layer, at least one electrical interconnect extending through the piezoelectric layer and the at least one dielectric layer, and a substrate layer having at least one electrical connection extending through the substrate layer, the at least one electrical connection and the at least one electrical interconnect being electrically connected.
A method of forming a multi-layer piezoelectric substrate, the method comprising:
- aligning at least one electrical interconnect of a first part of the multi-layer piezoelectric substrate and at least one electrical interconnect of a second part of the multi-layer piezoelectric substrate by bringing the at least one electrical interconnect into contact,
- the first part of the multi-layer piezoelectric substrate comprising a substrate layer, at least one electrical connection extending through the substrate layer, at least one first dielectric layer, and the at least one electrical interconnect extending through the at least one first dielectric layer, and
- the second part of the multi-layer piezoelectric substrate including a piezoelectric layer and the least one electrical interconnect extending through the piezoelectric layer;
- and
- bonding the first part of the multi-layer piezoelectric substrate and the second part of the multi-layer piezoelectric substrate.
2 more elements
Dependencies are inferred from the claim text.