Packaged acoustic wave devices with multi-layer piezoelectric substrate with seal ring spaced from piezoelectric layers

A radio frequency module comprising:

• a package substrate;
• a packaged acoustic wave component including a first acoustic wave device including a first multi-layer piezoelectric substrate including at least a first piezoelectric layer disposed over a portion of a first support layer such that the first support layer extends outward from ends of the first piezoelectric layer, and a first interdigital transducer electrode, a second acoustic wave device including a second piezoelectric layer disposed over a portion of a second support layer such that the second support layer extends outward from ends of the second piezoelectric layer, and a second interdigital transducer electrode, the first acoustic wave device stacked with the second acoustic wave device so that the first and second interdigital transducer electrodes face and are spaced apart from each other, and a thermally conductive frame connected between the first and second support layers of the first and second acoustic wave devices with the thermally conductive frame spaced outward from the ends of the first and second piezoelectric layers by a gap, the thermally conductive frame in contact with the first and second support structures to transfer heat generated by the first acoustic wave device to the second acoustic wave device;
• and
• additional circuitry, the packaged acoustic wave component and additional circuitry disposed on the package substrate.

A wireless communication device comprising:

• an antenna;
• and
• a front end module including one or more packaged acoustic wave components configured to filter a radio frequency signal associated with the antenna, each surface packaged acoustic wave component including a first acoustic wave device including a first multi-layer piezoelectric substrate including at least a first piezoelectric layer disposed over a portion of a first support layer such that the first support layer extends outward from ends of the first piezoelectric layer, and a first interdigital transducer electrode, a second acoustic wave device including a second piezoelectric layer disposed over a portion of a second support layer such that the second support layer extends outward from ends of the second piezoelectric layer, and a second interdigital transducer electrode, the first acoustic wave device stacked with the second acoustic wave device so that the first and second interdigital transducer electrodes face and are spaced apart from each other, and a thermally conductive frame connected between the first and second support layers of the first and second acoustic wave devices with the thermally conductive frame spaced outward from the ends of the first and second piezoelectric layers by a gap, the thermally conductive frame in contact with the first and second support structures to transfer heat generated by the first acoustic wave device to the second acoustic wave device.