H03H 9/1071
The enclosure being defined by a frame built on a substrate and
Official title: {the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device}
H03H9/1071 (The enclosure being defined by a frame built on a substrate and) appears on 491 US grants and 513 published applications in this corpus.
Search patents in H03H- Granted patents
- 491
- Published applications
- 513
- Assignees
- 111
- Inventors
- 764
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 3 | 0 |
| 1994 | 1 | 0 |
| 1995 | 7 | 0 |
| 1996 | 5 | 0 |
| 1997 | 3 | 0 |
| 1998 | 10 | 0 |
| 1999 | 13 | 0 |
| 2000 | 11 | 0 |
| 2001 | 8 | 4 |
| 2002 | 14 | 20 |
| 2003 | 8 | 14 |
| 2004 | 11 | 26 |
| 2005 | 19 | 24 |
| 2006 | 16 | 17 |
| 2007 | 17 | 11 |
| 2008 | 7 | 8 |
| 2009 | 10 | 4 |
| 2010 | 3 | 9 |
| 2011 | 9 | 12 |
| 2012 | 7 | 11 |
| 2013 | 13 | 15 |
| 2014 | 11 | 23 |
| 2015 | 15 | 15 |
| 2016 | 17 | 20 |
| 2017 | 17 | 39 |
| 2018 | 19 | 31 |
| 2019 | 38 | 34 |
| 2020 | 34 | 47 |
| 2021 | 27 | 21 |
| 2022 | 32 | 25 |
| 2023 | 28 | 32 |
| 2024 | 24 | 25 |
| 2025 | 16 | 20 |
| 2026 | 13 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Bulk acoustic wave device packaging with redistribution using silicon dioxide insulation25 Aug 2026US 12,719,440 B2Skyworks Solutions, Inc.
- Packaged acoustic wave devices with multi-layer piezoelectric substrate with seal ring spaced from piezoelectric layers14 Jul 2026US 12,683,577 B2Skyworks Solutions, Inc.
- Integration of carbon nanotubes in package filler and gel overcoat16 Jun 2026US 12,658,881 B2Skyworks Solutions, Inc.
- Acoustic wave device and fabrication method thereof26 May 2026US 12,640,700 B2RichWave Technology Corp.
- Package structure and method for manufacturing the same19 May 2026US 12,635,572 B2Advanced Semiconductor Engineering, Inc.
- Packaged acoustic wave devices with multi-layer piezoelectric substrate with seal ring spaced from piezoelectric layers8 Oct 2026US 2026/0312563 A1Skyworks Solutions, Inc.
- Packaged surface acoustic wave device with conductive roof supporting structure20 Aug 2026US 2026/0246449 A1Skyworks Solutions, Inc.
- Acoustic Wave Device and Module25 Jun 2026US 2026/0180548 A1Sanan Japan Technology Corporation
- Multi-stack acoustic wave device18 Jun 2026US 2026/0172002 A1Skyworks Solutions, Inc.
- Acoustic wave device14 May 2026US 2026/0135540 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Surface acoustic wave device mounted module473US 5,459,368 AMatsushita Electric Industrial Co., Ltd. · 1995
- Electronic part and a method of production thereof357US 5,920,142 AMatsushita Electric Industrial Co., Ltd. · 1999
- Surface acoustic wave devices having a guard layer350US 5,699,027 AMatsushita Electric Industrial Co., Ltd. · 1997
- Method for producing a cover, method for producing a packaged device282US 7,288,435 B2Infineon Technologies AG · 2007
- Mass simultaneous sealing and electrical connection of electronic devices149US 5,448,014 ATRW Inc. · 1995