Multi-stack acoustic wave device
AssigneeSkyworks Solutions, Inc.
InventorHoward E. Chen
Life of this patent
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AssigneeSkyworks Solutions, Inc.
InventorHoward E. Chen
Estimating the term…
A multi-stack acoustic wave device is provided that comprises a substrate, a first die having a first portion having one or more electrodes and a second portion positioned away from the first portion, the one or more electrodes of the first die being electrically connected with one or more electrodes of the substrate, a second die having a first portion having one or more electrodes and a second portion positioned away from the first portion, the first die being positioned between the second die and the substrate, the second portion of the first die being coupled to the second portion of the second die, and a packaging structure encapsulating at least a portion of the second die and having one or more electrodes positioned away from the substrate, the one or more electrodes of the second die being electrically connected to the one or more electrodes of the packaging structure.
A multi-stack acoustic wave device comprising:
A radio-frequency module comprising a multi-stack acoustic wave device having:
A wireless mobile device comprising:
Dependencies are inferred from the claim text.