US 2026/0135540 A1Published application

Acoustic wave device

AssigneeMurata Manufacturing Co., Ltd.

InventorsMasaaki MATSUMORI, Takahiro TSUTAYA, Hiroshi SOMADA

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Abstract

An acoustic wave device includes a substrate including first and second main surfaces facing away from each other, a substrate including a third main surface facing the first main surface, a functional electrode on the third main surface, a support portion positioned between the main surface and the main surface to provide a space between the first and third main surfaces, and a via conductor in the substrate and extending from the first main surface toward the second main surface. The support portion includes a first metal film on the first main surface and a second metal film on the third main surface, and a ratio of an area of the first metal film to that of the first main surface is larger than a ratio of an area of the second metal film to that of the third main surface.

Claims20

Dependent claims

An acoustic wave device comprising:

a first substrate including a first main surface and a second main surface facing away from each other;
a second substrate including a third main surface facing the first main surface;
a functional electrode on the third main surface;
a support portion positioned between the first main surface and the third main surface to provide a space between the first main surface and the third main surface;
and
a via conductor in the first substrate and extending from the first main surface toward the second main surface;
wherein
the support portion includes a first metal film on the first main surface and a second metal film on the third main surface and connected to the functional electrode;
and
in plan view of the first main surface and the third main surface, a ratio of an area of the first metal film to an area of the first main surface is larger than a ratio of an area of the second metal film to an area of the third main surface.

7 more elements

An acoustic wave device comprising:

a first substrate including a first main surface and a second main surface facing away from each other;
a second substrate including a third main surface facing the first main surface;
a functional electrode on the third main surface;
a support portion between the first main surface and the third main surface to provide a space between the first main surface and the third main surface;
and
a via conductor in the first substrate and extending from the first main surface toward the second main surface;
wherein
the support portion includes a first metal film on the first main surface, and a second metal film on the third main surface and connected to the functional electrode;
the first metal film is connected to a ground through the via conductor;
in plan view of the first main surface and the third main surface, the first metal film overlaps at least a portion of the functional electrode.

7 more elements

Dependencies are inferred from the claim text.

Facts

Application: 19/442,070Filed 7 Jan 2026
Priority: JP 2023-1296989 Aug 2023
Published: 14 May 2026
Term ends: Not estimatedThe source records don’t support an estimate.

Classification10 codes

H03H 9/15
Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators: constructional features of resonators consisting…
H03H 9/02
Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators: details
H03H 9/02574
Characteristics of substrate, e.g. cutting angles: of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical…
H03H 9/02992
Of surface acoustic wave devices: details of bus bars, contact pads or other electrical connections for finger electrodes