Integration of carbon nanotubes in package filler and gel overcoat
AssigneeSkyworks Solutions, Inc.
InventorAkio Mitsuhashi
Life of this patent
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Abstract
An electronic component enclosed in a protective packaging, the protective packaging comprises a gel material and an electrically conductive filler material. The electrically conductive filler material is mixed into the gel material for formulating a package filler. The package filler is configured to form a protective layer over the electronic component for attenuating at least part of an electromagnetic wave input to the electronic component according to input wave strength.
Claims20
An electronic component enclosed in a protective packaging, the protective packaging comprising:
- a gel material;
- and
- an electrically conductive filler material which is mixed into the gel material for formulating a package filler, the package filler being configured to form a protective layer over the electronic component for adjusting or attenuating at least part of an electromagnetic wave input to the electronic component according to input wave strength.
A package filler for packaging an electronic component, comprising:
- a gel material;
- and
- an electrically conductive filler material which is mixed into the gel material for forming a package filler, the package filler being configured to form a protective layer of the electronic component for attenuating at least part of an electromagnetic wave input to the electronic component according to input wave strength.
Dependencies are inferred from the claim text.