H01J 37/32935
Monitoring and controlling tubes by information coming from the object and/or discharge
Official title: {Monitoring and controlling tubes by information coming from the object and/or discharge}
H01J37/32935 (Monitoring and controlling tubes by information coming from the object and/or discharge) appears on 2,360 US grants and 2,846 published applications in this corpus.
Search patents in H01J- Granted patents
- 2,360
- Published applications
- 2,846
- Assignees
- 548
- Inventors
- 4,728
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 2 | 0 |
| 1979 | 3 | 0 |
| 1980 | 3 | 0 |
| 1981 | 5 | 0 |
| 1982 | 10 | 0 |
| 1983 | 4 | 0 |
| 1984 | 2 | 0 |
| 1985 | 5 | 0 |
| 1986 | 8 | 0 |
| 1987 | 7 | 0 |
| 1988 | 4 | 0 |
| 1989 | 10 | 0 |
| 1990 | 16 | 0 |
| 1991 | 9 | 0 |
| 1992 | 13 | 0 |
| 1993 | 15 | 0 |
| 1994 | 21 | 0 |
| 1995 | 21 | 0 |
| 1996 | 20 | 0 |
| 1997 | 18 | 0 |
| 1998 | 36 | 0 |
| 1999 | 39 | 0 |
| 2000 | 42 | 0 |
| 2001 | 34 | 16 |
| 2002 | 38 | 41 |
| 2003 | 60 | 81 |
| 2004 | 70 | 131 |
| 2005 | 60 | 128 |
| 2006 | 61 | 110 |
| 2007 | 51 | 93 |
| 2008 | 68 | 95 |
| 2009 | 48 | 118 |
| 2010 | 69 | 91 |
| 2011 | 67 | 54 |
| 2012 | 64 | 73 |
| 2013 | 54 | 66 |
| 2014 | 71 | 76 |
| 2015 | 60 | 89 |
| 2016 | 80 | 134 |
| 2017 | 91 | 117 |
| 2018 | 104 | 127 |
| 2019 | 106 | 109 |
| 2020 | 125 | 122 |
| 2021 | 86 | 154 |
| 2022 | 93 | 139 |
| 2023 | 107 | 170 |
| 2024 | 146 | 198 |
| 2025 | 144 | 183 |
| 2026 | 90 | 131 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- High power generator and method of supplying high power pulses6 Oct 2026US 12,755,932 B2Trumpf Huettinger Sp. Z O. O.
- High power generator and method of supplying high power pulses6 Oct 2026US 12,755,933 B2Trumpf Huettinger Sp. Z O. O.
- Pulsed voltage waveform with binary pulses for biasing of plasma6 Oct 2026US 12,755,934 B2APPLIED Materials.Inc.
- Arc current reduction from an electrostatic chuck6 Oct 2026US 12,757,680 B2APPLIED Materials.Inc.
- Pulse-mode control in a bias supply29 Sep 2026US 12,749,652 B2Advanced Energy Industries, Inc.
- Wave-assisted hybrid plasma source8 Oct 2026US 2026/0311966 A1Tokyo Electron Limited
- Detecting and locating anomalous plasma events in multi-station processing chambers8 Oct 2026US 2026/0311976 A1Lam Research Corporation
- Measuring device, measuring method, and vacuum processing apparatus8 Oct 2026US 2026/0311977 A1Tokyo Electron Limited
- Metrology Enclosure Including Spectral Reflectometry System for Plasma Processing System Using Direct-Drive Radiofrequency Power Supply1 Oct 2026US 2026/0302144 A1Lam Research Corporation
- High-performance adaptable sampling system1 Oct 2026US 2026/0302145 A1Tokyo Electron Limited
Most cited
By later US patents
- Plasma monitoring and control method and system625US 5,576,629 AFourth State Technology, Inc. · 1996
- Method and apparatus for surface treatment by plasma617US 4,579,623 AHitachi, Ltd. · 1986
- Plasma processing method and film forming method509US 7,771,796 B2Tokyo Electron Limited · 2010
- Plasma monitoring and control method and system503US 5,939,886 AAdvanced Energy Industries, Inc. · 1999
- Apparatus and process for sensing fluoro species in semiconductor processing systems484US 7,080,545 B2Advanced Technology Materials, Inc. · 2006