H01J 37/32963
End-point detection
Official title: {End-point detection}
H01J37/32963 (End-point detection) appears on 396 US grants and 384 published applications in this corpus.
Search patents in H01J- Granted patents
- 396
- Published applications
- 384
- Assignees
- 141
- Inventors
- 889
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 8 | 0 |
| 1994 | 6 | 0 |
| 1995 | 7 | 0 |
| 1996 | 9 | 0 |
| 1997 | 4 | 0 |
| 1998 | 13 | 0 |
| 1999 | 20 | 0 |
| 2000 | 12 | 0 |
| 2001 | 16 | 6 |
| 2002 | 11 | 9 |
| 2003 | 19 | 16 |
| 2004 | 8 | 23 |
| 2005 | 14 | 16 |
| 2006 | 17 | 12 |
| 2007 | 5 | 5 |
| 2008 | 4 | 16 |
| 2009 | 2 | 14 |
| 2010 | 12 | 11 |
| 2011 | 10 | 5 |
| 2012 | 7 | 8 |
| 2013 | 6 | 10 |
| 2014 | 9 | 6 |
| 2015 | 5 | 11 |
| 2016 | 4 | 20 |
| 2017 | 14 | 24 |
| 2018 | 20 | 22 |
| 2019 | 20 | 13 |
| 2020 | 21 | 23 |
| 2021 | 11 | 19 |
| 2022 | 20 | 20 |
| 2023 | 14 | 25 |
| 2024 | 18 | 23 |
| 2025 | 20 | 16 |
| 2026 | 7 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Advanced OES characterization29 Sep 2026US 12,749,664 B2Tokyo Electron Limited
- Endpoint detection in low open area and/or high aspect ratio etch applications22 Sep 2026US 12,745,608 B2APPLIED Materials.Inc.
- Plasma processing method and plasma processing apparatus11 Aug 2026US 12,706,286 B2Hitachi High-Tech Corporation
- Surface processing equipment2 Jun 2026US 12,646,696 B2Industrial Technology Research Institute
- Optical cable for interferometric endpoint detection3 Mar 2026US 12,567,569 B2APPLIED Materials.Inc.
- Endpoint detection using spectral or temporal pattern matching3 Sep 2026US 2026/0260858 A1Lam Research Corporation
- System and method for remote sensing a plasma30 Jul 2026US 2026/0221401 A1Dublin City University
- System and method for endpoint detection23 Jul 2026US 2026/0213145 A1Tokyo Electron Limited
- Spectral sensing of process chamber conditions16 Jul 2026US 2026/0202340 A1Lam Research Corporation
- Angle-Actuated Capacitive Sensor for Accurate Angled Deposition or Etch Process Monitoring25 Jun 2026US 2026/0179891 A1
Most cited
By later US patents
- Plasma monitoring and control method and system625US 5,576,629 AFourth State Technology, Inc. · 1996
- Plasma monitoring and control method and system503US 5,939,886 AAdvanced Energy Industries, Inc. · 1999
- Methods and apparatus for pre-stabilized plasma generation for microwave clean applications291US 5,939,831 AAPPLIED Materials.Inc. · 1999
- Plasma processing apparatus287US 5,571,366 ATokyo Electron Limited · 1996
- Automatic impedance matching apparatus and method281US 5,195,045 AASTEC America, Inc. · 1993