H01J 37/32981
Gas analysis
Official title: {Gas analysis}
H01J37/32981 (Gas analysis) appears on 96 US grants and 165 published applications in this corpus.
Search patents in H01J- Granted patents
- 96
- Published applications
- 165
- Assignees
- 55
- Inventors
- 368
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 1 | 6 |
| 2005 | 1 | 3 |
| 2006 | 1 | 1 |
| 2007 | 3 | 1 |
| 2008 | 0 | 0 |
| 2009 | 1 | 1 |
| 2010 | 1 | 2 |
| 2011 | 1 | 2 |
| 2012 | 1 | 0 |
| 2013 | 0 | 4 |
| 2014 | 3 | 5 |
| 2015 | 5 | 5 |
| 2016 | 2 | 5 |
| 2017 | 4 | 11 |
| 2018 | 5 | 10 |
| 2019 | 5 | 8 |
| 2020 | 15 | 7 |
| 2021 | 6 | 11 |
| 2022 | 8 | 11 |
| 2023 | 7 | 14 |
| 2024 | 9 | 23 |
| 2025 | 9 | 21 |
| 2026 | 6 | 14 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- System and method for adaptive cleaning of a high-vacuum chamber11 Aug 2026US 12,706,285 B2IBSS Group
- High-performance adaptable sampling system14 Jul 2026US 12,683,135 B2Tokyo Electron Limited
- Substrate processing method19 May 2026US 12,633,497 B2Tokyo Electron Limited
- Analysis device, analysis method, and analysis program19 May 2026US 12,633,505 B2HORIBA STEC, Co., Ltd.
- Apparatus for treating substrate and method for treating substrate3 Mar 2026US 12,567,570 B2Semes Co., Ltd.
- High-performance adaptable sampling system1 Oct 2026US 2026/0302145 A1Tokyo Electron Limited
- Spectral sensing of process chamber conditions16 Jul 2026US 2026/0202340 A1Lam Research Corporation
- Plasma processing apparatus16 Jul 2026US 2026/0204516 A1Tokyo Electron Limited
- Apparatus for real-time line width measurement in dry etching process16 Jul 2026US 2026/0206527 A1
- Downstream port gases introduced into plasma abatement system25 Jun 2026US 2026/0179884 A1APPLIED Materials.Inc.
Most cited
By later US patents
- Apparatus and process for sensing fluoro species in semiconductor processing systems484US 7,080,545 B2Advanced Technology Materials, Inc. · 2006
- Method for controlling cyclic plasma-assisted process484US 8,790,743 B1ASM IP Holding B. V. · 2014
- Apparatus and process for sensing fluoro species in semiconductor processing systems478US 7,296,460 B2Advanced Technology Materials, Inc. · 2007
- Apparatus and process for sensing fluoro species in semiconductor processing systems476US 7,475,588 B2Advanced Technology Materials, Inc. · 2009
- Controlling dry etch process characteristics using waferless dry clean optical emission spectroscopy46US 10,773,282 B2Tokyo Electron Limited · 2020