Apparatus for treating substrate and method for treating substrate
AssigneeSemes Co., Ltd.
InventorChang Mok Kim
Life of this patent
Estimating the term…
Abstract
Disclosed is an apparatus for treating a substrate. The substrate treating apparatus may include a chamber for generating plasma in a treating space and treating a substrate using the plasma, and a measurement unit for monitoring light emitted from the plasma of the treating space, in which the measurement unit may include a light collection unit for collecting the light passing through a view port formed on one side wall of the chamber; and an optical cable having a connection terminal fastened to the light collection unit formed at one end to transmit the light, in which a measurement member capable of measuring a fastening length between the light collection unit and the optical cable is disposed in the connection terminal.
Claims13
A substrate treating apparatus for treating a substrate comprising:
- a chamber including a treating space and configured to generate plasma in the treating space and treat a substrate using the plasma;
- and
- a measurement unit configured to monitor light emitted from the plasma of the treating space,
- wherein the measurement unit comprises
- a light collection unit configured to collect the light passing through a view port defined on one side wall of the chamber, the light collection unit including a collection terminal and a groove, the collection terminal at on inner wall of the light collection unit and the groove defined by an outer wall of the light collection unit, the collection terminal and the groove overlapping each other when viewed from a front, and
- an optical cable having a connection terminal at one end thereof and configured to transmit the light, a partial region of the connection terminal fastened to the groove of the light collection unit, and
- wherein a measurement member capable of measuring a fastening length between the light collection unit and the optical cable is in the connection terminal.
A substrate treating apparatus for treating a substrate comprising:
- a chamber having a view port and a treating space therein;
- a support unit configured to support the substrate in the treating space;
- a gas supply unit configured to supply gas to the treating space;
- a plasma source configured to generate plasma by exciting the gas in the treating space and treat the substrate using the plasma;
- and
- a measurement unit configured to monitor light emitting from the plasma,
- wherein the measurement unit comprises
- a light collection unit configured to collect the light passing through the view;
- port defined on one side wall of the chamber, the light collection unit including a collection terminal and a groove, the collection terminal at on inner wall of the light collection unit and the groove defined by an outer wall of the light collection unit, the collection terminal and the groove overlapping each other when viewed from a front,
- an analysis unit configured to detect an end point of the treating of the substrate by analyzing peak data of the light transmitted from the light collection unit,
- an optical cable connected to the light collection unit and the analysis unit and configured to transmit the light from the light collection unit to the analysis unit,
- a connection terminal at one end of the optical cable, a partial region of the connection terminal fastened to the groove of the light collection unit, and
- a measurement member capable of measuring a fastening length between the light collection unit and the optical cable is in the connection terminal.
Dependencies are inferred from the claim text.