H01J 37/32972
Spectral analysis
Official title: {Spectral analysis}
H01J37/32972 (Spectral analysis) appears on 446 US grants and 591 published applications in this corpus.
Search patents in H01J- Granted patents
- 446
- Published applications
- 591
- Assignees
- 165
- Inventors
- 1,197
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 6 | 0 |
| 1995 | 0 | 0 |
| 1996 | 3 | 0 |
| 1997 | 3 | 0 |
| 1998 | 8 | 0 |
| 1999 | 4 | 0 |
| 2000 | 9 | 0 |
| 2001 | 3 | 1 |
| 2002 | 2 | 0 |
| 2003 | 6 | 9 |
| 2004 | 9 | 18 |
| 2005 | 9 | 19 |
| 2006 | 7 | 12 |
| 2007 | 6 | 17 |
| 2008 | 11 | 16 |
| 2009 | 9 | 16 |
| 2010 | 7 | 11 |
| 2011 | 8 | 10 |
| 2012 | 10 | 17 |
| 2013 | 7 | 17 |
| 2014 | 20 | 20 |
| 2015 | 14 | 17 |
| 2016 | 17 | 48 |
| 2017 | 22 | 26 |
| 2018 | 26 | 36 |
| 2019 | 32 | 28 |
| 2020 | 34 | 36 |
| 2021 | 19 | 34 |
| 2022 | 22 | 31 |
| 2023 | 19 | 32 |
| 2024 | 35 | 56 |
| 2025 | 36 | 30 |
| 2026 | 21 | 34 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Advanced OES characterization29 Sep 2026US 12,749,664 B2Tokyo Electron Limited
- Real-time detection of particulate matter during deposition chamber manufacturing15 Sep 2026US 12,738,467 B2APPLIED Materials.Inc.
- Non-invasive measurement of plasma systems25 Aug 2026US 12,719,034 B2Dublin City University
- Profile simulation calibration with in-situ sensor data25 Aug 2026US 12,719,035 B2Tokyo Electron Limited
- Plasma processing method and plasma processing apparatus11 Aug 2026US 12,706,286 B2Hitachi High-Tech Corporation
- Wave-assisted hybrid plasma source8 Oct 2026US 2026/0311966 A1Tokyo Electron Limited
- Measuring device, measuring method, and vacuum processing apparatus8 Oct 2026US 2026/0311977 A1Tokyo Electron Limited
- Metrology Enclosure Including Spectral Reflectometry System for Plasma Processing System Using Direct-Drive Radiofrequency Power Supply1 Oct 2026US 2026/0302144 A1Lam Research Corporation
- High-performance adaptable sampling system1 Oct 2026US 2026/0302145 A1Tokyo Electron Limited
- Real-time detection of particulate matter during deposition chamber manufacturing24 Sep 2026US 2026/0290768 A1APPLIED Materials.Inc.
Most cited
By later US patents
- Inductively coupled plasma spectrometer for process diagnostics and control435US 6,867,859 B1Lightwind Corporation · 2005
- Method of monitoring deposit in chamber, method of plasma processing, method of dry-cleaning chamber, and semiconductor manufacturing apparatus368US 5,897,378 AMatsushita Electric Industrial Co., Ltd. · 1999
- Plasma processing system and apparatus and a sample processing method269US 6,755,932 B2Hitachi, Ltd. · 2004
- Method for monitoring process endpoints in a plasma chamber and a process monitoring arrangement in a plasma chamber171US 5,846,373 ALam Research Corporation · 1998
- Systems and methods for internal surface conditioning in plasma processing equipment149US 9,355,922 B2APPLIED Materials.Inc. · 2016