H01J 37/32743
For introducing the material into processing chamber
Official title: {for introducing the material into processing chamber}
H01J37/32743 (For introducing the material into processing chamber) appears on 240 US grants and 350 published applications in this corpus.
Search patents in H01J- Granted patents
- 240
- Published applications
- 350
- Assignees
- 112
- Inventors
- 871
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 3 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 3 | 0 |
| 2001 | 6 | 1 |
| 2002 | 3 | 7 |
| 2003 | 1 | 7 |
| 2004 | 6 | 3 |
| 2005 | 4 | 9 |
| 2006 | 2 | 7 |
| 2007 | 2 | 3 |
| 2008 | 1 | 3 |
| 2009 | 1 | 8 |
| 2010 | 2 | 10 |
| 2011 | 4 | 8 |
| 2012 | 5 | 4 |
| 2013 | 2 | 3 |
| 2014 | 2 | 3 |
| 2015 | 5 | 14 |
| 2016 | 3 | 13 |
| 2017 | 6 | 19 |
| 2018 | 9 | 17 |
| 2019 | 9 | 22 |
| 2020 | 17 | 26 |
| 2021 | 19 | 23 |
| 2022 | 22 | 37 |
| 2023 | 13 | 32 |
| 2024 | 24 | 35 |
| 2025 | 32 | 19 |
| 2026 | 17 | 17 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Methods for reducing photoresist and carbon etch rates in an ICP process chamber using a silicon-based chamber pre-coat6 Oct 2026US 12,757,659 B2APPLIED Materials.Inc.
- Substrate treatment apparatus and semiconductor device manufacturing method using the same15 Sep 2026US 12,738,464 B2Samsung Electronics Co., Ltd.
- Higher pressure purge for impurity reduction in radical treatment chamber8 Sep 2026US 12,731,769 B2APPLIED Materials.Inc.
- Substrate treating apparatus and substrate treating method18 Aug 2026US 12,712,163 B2Semes Co., Ltd.
- Surface treatment apparatus and surface treatment method11 Aug 2026US 12,703,908 B2Shibaura Machine Co., Ltd.
- Higher pressure purge for impurity reduction in radical treatment chamber1 Oct 2026US 2026/0302143 A1APPLIED Materials.Inc.
- Improved plasma products and methods for producing same by using multiple simultaneous electrical discharges24 Sep 2026US 2026/0290760 A1Plazer IP, LLC
- Wafer processing method and integrated etching-deposition equipment for wafer processing24 Sep 2026US 2026/0290769 A1Advanced Micro-Fabrication Equipment Inc. China
- Substrate processing system, substrate processing method, and non-transitory computer-readable storage medium17 Sep 2026US 2026/0282825 A1Tokyo Electron Limited
- Substrate processing apparatus including shared rf generator6 Aug 2026US 2026/0229461 A1ASM IP Holding B. V.
Most cited
By later US patents
- Plasma processing apparatus577US 6,673,196 B1Tokyo Electron Limited · 2004
- Atomic layer deposition with plasma source419US 9,868,131 B2Picosun Oy · 2018
- Symmetric plasma process chamber389US 9,741,546 B2APPLIED Materials.Inc. · 2017
- Atomic layer deposition with plasma source364US 9,095,869 B2Picosun Oy · 2015
- Clustertool system software using plasma immersion ion implantation336US 6,321,134 B1Silicon Genesis Corporation · 2001