Clustertool system software using plasma immersion ion implantation

A clustertool system for forming substrates, said clustertool including a memory comprising:

• a code directed to providing a donor substrate;
• a code directed to placing said donor substrate in a plasma immersion ion implantation chamber;
• a code directed to introducing plasma particles through a surface of said donor substrate to a selected depth underneath said surface, said particles being at a concentration at said selected depth to define a substrate material to be removed above said selected depth;
• a code directed to placing said donor substrate in a second chamber and joining said donor substrate to a target substrate, said surface of said donor substrate facing a face of said target substrate to form a multi-layered substrate;
• a code directed to placing said multi-layered substrate in a third chamber;
• and
• a code directed to providing energy to a selected region of said substrate to initiate a controlled cleaving action at said selected depth in said substrate wherein said code directed to providing energy increases a controlled stress in said substrate material and sustains said controlled cleaving action to remove said substrate material from said donor substrate to provide a film of material, whereupon said cleaving action is made using a propagating cleave front to free a portion of said substrate material to be removed from said substrate.