H01J 37/32733
Means for moving the material to be treated
Official title: {Means for moving the material to be treated}
H01J37/32733 (Means for moving the material to be treated) appears on 893 US grants and 1,264 published applications in this corpus.
Search patents in H01J- Granted patents
- 893
- Published applications
- 1,264
- Assignees
- 424
- Inventors
- 2,902
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 3 | 0 |
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 7 | 0 |
| 1985 | 1 | 0 |
| 1986 | 6 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 4 | 0 |
| 1990 | 6 | 0 |
| 1991 | 3 | 0 |
| 1992 | 4 | 0 |
| 1993 | 11 | 0 |
| 1994 | 9 | 0 |
| 1995 | 8 | 0 |
| 1996 | 9 | 0 |
| 1997 | 11 | 0 |
| 1998 | 10 | 0 |
| 1999 | 16 | 0 |
| 2000 | 16 | 0 |
| 2001 | 18 | 5 |
| 2002 | 9 | 14 |
| 2003 | 5 | 18 |
| 2004 | 11 | 17 |
| 2005 | 11 | 25 |
| 2006 | 8 | 22 |
| 2007 | 4 | 17 |
| 2008 | 8 | 28 |
| 2009 | 5 | 28 |
| 2010 | 11 | 39 |
| 2011 | 16 | 46 |
| 2012 | 20 | 23 |
| 2013 | 17 | 29 |
| 2014 | 23 | 44 |
| 2015 | 24 | 72 |
| 2016 | 32 | 85 |
| 2017 | 40 | 80 |
| 2018 | 40 | 83 |
| 2019 | 56 | 86 |
| 2020 | 60 | 80 |
| 2021 | 48 | 77 |
| 2022 | 63 | 100 |
| 2023 | 52 | 78 |
| 2024 | 66 | 91 |
| 2025 | 74 | 50 |
| 2026 | 41 | 27 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor manufacturing apparatus and semiconductor device manufacturing method6 Oct 2026US 12,755,946 B2Kioxia Corporation
- Methods for reducing photoresist and carbon etch rates in an ICP process chamber using a silicon-based chamber pre-coat6 Oct 2026US 12,757,659 B2APPLIED Materials.Inc.
- Substrate treatment apparatus and semiconductor device manufacturing method using the same15 Sep 2026US 12,738,464 B2Samsung Electronics Co., Ltd.
- Higher pressure purge for impurity reduction in radical treatment chamber8 Sep 2026US 12,731,769 B2APPLIED Materials.Inc.
- Apparatus for treating substrate and method for treating substrate1 Sep 2026US 12,725,765 B2Psk Inc.
- Measuring device, measuring method, and vacuum processing apparatus8 Oct 2026US 2026/0311977 A1Tokyo Electron Limited
- Higher pressure purge for impurity reduction in radical treatment chamber1 Oct 2026US 2026/0302143 A1APPLIED Materials.Inc.
- Improved plasma products and methods for producing same by using multiple simultaneous electrical discharges24 Sep 2026US 2026/0290760 A1Plazer IP, LLC
- Wafer processing method and integrated etching-deposition equipment for wafer processing24 Sep 2026US 2026/0290769 A1Advanced Micro-Fabrication Equipment Inc. China
- Substrate transfer system and transfer module17 Sep 2026US 2026/0279743 A1Tokyo Electron Limited
Most cited
By later US patents
- Plasma processing apparatus577US 6,673,196 B1Tokyo Electron Limited · 2004
- Vertical plasma enhanced process apparatus and method489US 6,321,680 B2Torrex Equipment Corporation · 2001
- Atomic layer deposition with plasma source419US 9,868,131 B2Picosun Oy · 2018
- Multi-zone reactor, system including the reactor, and method of using the same418US 10,276,355 B2ASM IP Holding B. V. · 2019
- Symmetric plasma process chamber389US 9,741,546 B2APPLIED Materials.Inc. · 2017