H01J 37/32752
For moving the material across the discharge
Official title: {for moving the material across the discharge}
H01J37/32752 (For moving the material across the discharge) appears on 405 US grants and 543 published applications in this corpus.
Search patents in H01J- Granted patents
- 405
- Published applications
- 543
- Assignees
- 286
- Inventors
- 1,316
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 3 | 0 |
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 6 | 0 |
| 1985 | 1 | 0 |
| 1986 | 4 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 3 | 0 |
| 1991 | 1 | 0 |
| 1992 | 4 | 0 |
| 1993 | 7 | 0 |
| 1994 | 7 | 0 |
| 1995 | 7 | 0 |
| 1996 | 6 | 0 |
| 1997 | 5 | 0 |
| 1998 | 5 | 0 |
| 1999 | 11 | 0 |
| 2000 | 12 | 0 |
| 2001 | 7 | 2 |
| 2002 | 3 | 6 |
| 2003 | 3 | 6 |
| 2004 | 3 | 12 |
| 2005 | 5 | 6 |
| 2006 | 5 | 8 |
| 2007 | 2 | 12 |
| 2008 | 5 | 21 |
| 2009 | 3 | 20 |
| 2010 | 6 | 22 |
| 2011 | 10 | 27 |
| 2012 | 14 | 18 |
| 2013 | 11 | 14 |
| 2014 | 13 | 27 |
| 2015 | 12 | 35 |
| 2016 | 22 | 45 |
| 2017 | 19 | 30 |
| 2018 | 18 | 48 |
| 2019 | 20 | 31 |
| 2020 | 24 | 34 |
| 2021 | 20 | 24 |
| 2022 | 23 | 34 |
| 2023 | 19 | 20 |
| 2024 | 17 | 26 |
| 2025 | 22 | 14 |
| 2026 | 9 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor manufacturing apparatus and semiconductor device manufacturing method6 Oct 2026US 12,755,946 B2Kioxia Corporation
- Substrate processing method and substrate processing apparatus23 Jun 2026US 12,662,734 B2Tokyo Electron Limited
- Method for coating metal2 Jun 2026US 12,644,177 B2Agc Glass Europe
- Continuous plasma processing system with adjustable electrode2 Jun 2026US 12,646,694 B2UVAT Technology Co., LTd.
- Atmospheric pressure plasma reduction of copper oxide to copper metal5 May 2026US 12,617,146 B1Surfx Technologies LLC
- Substrate processing apparatus7 May 2026US 2026/0125791 A1ACM Research Korea CO., LTD.
- System and method for plasma treatment with independent control of neutral particle and ion fluxes4 Dec 2025US 2025/0372354 A1Axcelis Technologies, Inc.
- Vacuum arrangement and method20 Nov 2025US 2025/0357078 A1Von Ardenne Asset GmbH & Co. KG
- Apparatus and Method for Plasma Enhanced Chemical Vapour Deposition23 Oct 2025US 2025/0327184 A1LeydenJar Technologies B.V.
- Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatus9 Oct 2025US 2025/0313955 A1Kokusai Electric Corporation
Most cited
By later US patents
- Substrate processing apparatus346US 8,741,065 B2Tokyo Electron Limited · 2014
- High flow vacuum chamber including equipment modules such as a plasma generating source, vacuum pumping arrangement and/or cantilevered substrate support168US 5,948,704 ALam Research Corporation · 1999
- One atmosphere, uniform glow discharge plasma139US 5,414,324 AThe University of Tennessee Research Corporation · 1995
- Apparatus for rapid plasma treatments and method138US 5,224,441 AThe BOC Group, Inc. · 1993
- Method and apparatus for glow discharge plasma treatment of polymer materials at atmospheric pressure95US 5,456,972 AThe University of Tennessee Research Corporation · 1995