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US 12,662,734 B2Granted
Substrate processing method and substrate processing apparatus
AssigneeTokyo Electron Limited
InventorsKiyoshi Mori, Haruhiko Furuya
Life of this patent
Estimating the term…
Abstract
A substrate processing method includes: exhausting a first space in a processing container by an exhaust mechanism, which is configured to exhaust the first space via a gap by exhausting a second space in the processing container, or configured to exhaust the first space in a state in which a seal gas is caused to flow from the second space to the first space via the gap; and executing the substrate processing on a substrate while causing, by a driving mechanism configured to move a stage, a position of the stage to be changed such that a width of the gap becomes uniform in a time average.
Claims13
A substrate processing method performed in a substrate processing apparatus,
- wherein the substrate processing apparatus comprises:
- a processing container;
- a stage disposed inside the processing container with a gap between an inner side wall of the processing container and a side surface of the stage or between a component constituting the processing container and the side surface of the stage, and configured to place a substrate on the stage, wherein the stage partitions an interior of the processing container into an upper first space, in which substrate processing is performed on the substrate, and a lower second space;
- an exhaust mechanism configured to exhaust the first space via the gap by exhausting the second space, or configured to exhaust the first space in a state in which a seal gas is caused to flow from the second space to the first space via the gap;
- and
- a driving mechanism configured to move the stage,
- wherein the substrate processing method comprises:
- exhausting the first space by the exhaust mechanism;
- and
- executing the substrate processing on the substrate while causing, by the driving mechanism, a position of the stage to be changed such that a width of the gap becomes uniform in a time average, and
- wherein the act of the executing the substrate processing includes executing the substrate processing on the substrate while causing, by the driving mechanism, the stage to move such that a center point of the stage reciprocates in a reciprocating direction that rotates in a horizontal plane.
8 more elements
A substrate processing method performed in a substrate processing apparatus,
- wherein the substrate processing apparatus comprises:
- a processing container;
- a stage disposed inside the processing container with a gap between an inner side wall of the processing container and a side surface of the stage or between a component constituting the processing container and the side surface of the stage, and configured to place a substrate on the stage, wherein the stage partitions an interior of the processing container into an upper first space, in which substrate processing is performed on the substrate, and a lower second space;
- an exhaust mechanism configured to exhaust the first space via the gap by exhausting the second space, or configured to exhaust the first space in a state in which a seal gas is caused to flow from the second space to the first space via the gap;
- and
- a driving mechanism configured to move the stage, wherein the substrate processing method comprises:
- exhausting the first space by the exhaust mechanism;
- and
- executing the substrate processing on the substrate while causing, by the driving mechanism, a position of the stage to be changed such that a width of the gap becomes uniform in a time average, and
- wherein the act of the executing the substrate processing includes executing the substrate processing on the substrate while causing, by the driving mechanism, the stage to move in a horizontal plane such that a trajectory along which a center point of the stage moves draws a circle in the horizontal plane.
7 more elements
A substrate processing apparatus comprising:
- a processing container;
- a stage disposed inside the processing container with a gap between an inner side wall of the processing container and a side surface of the stage or between a component constituting the processing container and the side surface of the stage, and configured to place a substrate on the stage, wherein the stage partitions an interior of the processing container into an upper first space, in which substrate processing is performed on the substrate, and a lower second space;
- an exhaust mechanism configured to exhaust the first space via the gap by exhausting the second space, or configured to exhaust the first space in a state in which a seal gas is caused to flow from the second space to the first space via the gap;
- a driving mechanism configured to move the stage;
- and
- a controller configured to execute the substrate processing on the substrate while causing, by the driving mechanism, a position of the stage to be changed such that a width of the gap becomes uniform in a time average,
- wherein the causing the position of the stage to be changed includes causing, by the driving mechanism, the stage to move such that a center point of the stage reciprocates in a reciprocating direction that rotates in a horizontal plane.
4 more elements
A substrate processing apparatus comprising:
- a processing container;
- a stage disposed inside the processing container with a gap between an inner side wall of the processing container and a side surface of the stage or between a component constituting the processing container and the side surface of the stage, and configured to place a substrate on the stage, wherein the stage partitions an interior of the processing container into an upper first space, in which substrate processing is performed on the substrate, and a lower second space;
- an exhaust mechanism configured to exhaust the first space via the gap by exhausting the second space, or configured to exhaust the first space in a state in which a seal gas is caused to flow from the second space to the first space via the gap;
- a driving mechanism configured to move the stage;
- and
- a controller configured to execute the substrate processing on the substrate while causing, by the driving mechanism, a position of the stage to be changed such that a width of the gap becomes uniform in a time average,
- wherein the causing the position of the stage to be changed includes causing, by the driving mechanism, the stage to move in a horizontal plane such that a trajectory along which a center point of the stage moves draws a circle in the horizontal plane.
4 more elements
Dependencies are inferred from the claim text.