H01J 37/32788
For extracting the material from the process chamber
Official title: {for extracting the material from the process chamber}
H01J37/32788 (For extracting the material from the process chamber) appears on 65 US grants and 99 published applications in this corpus.
Search patents in H01J- Granted patents
- 65
- Published applications
- 99
- Assignees
- 51
- Inventors
- 276
- Latest grant
- 6 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 0 |
| 2002 | 1 | 0 |
| 2003 | 1 | 3 |
| 2004 | 1 | 0 |
| 2005 | 0 | 3 |
| 2006 | 0 | 0 |
| 2007 | 1 | 0 |
| 2008 | 1 | 2 |
| 2009 | 0 | 1 |
| 2010 | 0 | 5 |
| 2011 | 2 | 2 |
| 2012 | 2 | 2 |
| 2013 | 0 | 4 |
| 2014 | 4 | 2 |
| 2015 | 3 | 4 |
| 2016 | 1 | 4 |
| 2017 | 0 | 11 |
| 2018 | 5 | 4 |
| 2019 | 1 | 5 |
| 2020 | 6 | 7 |
| 2021 | 7 | 13 |
| 2022 | 6 | 9 |
| 2023 | 3 | 8 |
| 2024 | 5 | 6 |
| 2025 | 7 | 3 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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Most cited
By later US patents
- Magnetic field-enhanced plasma etch reactor302US 4,842,683 AAPPLIED Materials.Inc. · 1989
- Method and apparatus for in-situ film stack processing172US 7,358,192 B2APPLIED Materials.Inc. · 2008
- Method for plasma etching tungsten94US 4,838,990 ATexas Instruments Incorporated · 1989
- Method and apparatus for reduction of voltage potential spike during dechucking56US 8,313,612 B2Lam Research Corporation · 2012
- Substrate damage prevention system and method55US 8,845,810 B2ADP Engineering Co., Ltd. · 2014