G03F 7/405
Treatment with inorganic or organometallic reagents after imagewise removal
Official title: {Treatment with inorganic or organometallic reagents after imagewise removal}
G03F7/405 (Treatment with inorganic or organometallic reagents after imagewise removal) appears on 497 US grants and 597 published applications in this corpus.
Search patents in G03F- Granted patents
- 497
- Published applications
- 597
- Assignees
- 188
- Inventors
- 1,308
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 3 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 3 | 0 |
| 1989 | 3 | 0 |
| 1990 | 4 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 5 | 0 |
| 1998 | 3 | 0 |
| 1999 | 4 | 0 |
| 2000 | 8 | 0 |
| 2001 | 8 | 2 |
| 2002 | 10 | 12 |
| 2003 | 15 | 28 |
| 2004 | 12 | 28 |
| 2005 | 11 | 24 |
| 2006 | 16 | 20 |
| 2007 | 17 | 20 |
| 2008 | 13 | 19 |
| 2009 | 11 | 13 |
| 2010 | 10 | 11 |
| 2011 | 10 | 16 |
| 2012 | 12 | 23 |
| 2013 | 11 | 33 |
| 2014 | 27 | 27 |
| 2015 | 30 | 31 |
| 2016 | 34 | 52 |
| 2017 | 35 | 37 |
| 2018 | 34 | 21 |
| 2019 | 27 | 35 |
| 2020 | 23 | 28 |
| 2021 | 20 | 18 |
| 2022 | 12 | 17 |
| 2023 | 11 | 26 |
| 2024 | 11 | 10 |
| 2025 | 17 | 33 |
| 2026 | 11 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Generation of multiline etch substrates25 Aug 2026US 12,721,060 B2Geminatio, Inc.
- Method for suppressing collapse of three-dimensional structure28 Jul 2026US 12,692,412 B2Tokyo Ohka Kogyo.Co., Ltd.
- Metallization method16 Jun 2026US 12,656,680 B2Dupont Electronic Materials International, LLC
- Tunable shrinkage and trim process for fabricating gratings9 Jun 2026US 12,650,379 B2Meta Platforms Technologies, LLC
- Photoresist developer and methods of use9 Jun 2026US 12,650,649 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Photoresist developer and methods of use1 Oct 2026US 2026/0299428 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate processing method3 Sep 2026US 2026/0262456 A1SCREEN Holdings Co., Ltd.
- Method for forming patterned photoresist13 Aug 2026US 2026/0235960 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Phosphorus-based film compositions and patterning methods30 Jul 2026US 2026/0219574 A1Tokyo Electron Limited
- Pattern transfer by directed self-assembly (dsa) of block copolymers (bcps)23 Jul 2026US 2026/0211330 A1APPLIED Materials.Inc.
Most cited
By later US patents
- Photoresist double patterning487US 8,282,847 B2Lam Research Corporation · 2012
- Sequential infiltration synthesis for enhancing multiple-patterning lithography424US 9,684,234 B2Uchicago Argonne, LLC · 2017
- Process for reducing edge roughness in patterned photoresist182US 6,709,807 B2Axcelis Technologies, Inc. · 2004
- Chemical feature doubling process161US 6,534,243 B1Advanced Micro Devices, Inc. · 2003
- Semiconductor device and method for manufacturing the same130US 5,858,620 AMitsubishi Denki Kabushiki Kaisha · 1999