G03F 7/40
Treatment after imagewise removal
Official title: Treatment after imagewise removal, e.g. baking
G03F7/40 (Treatment after imagewise removal) appears on 2,824 US grants and 3,538 published applications in this corpus.
Search patents in G03F- Granted patents
- 2,824
- Published applications
- 3,538
- Assignees
- 763
- Inventors
- 6,125
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 12 | 0 |
| 1982 | 7 | 0 |
| 1983 | 9 | 0 |
| 1984 | 7 | 0 |
| 1985 | 9 | 0 |
| 1986 | 9 | 0 |
| 1987 | 15 | 0 |
| 1988 | 11 | 0 |
| 1989 | 14 | 0 |
| 1990 | 10 | 0 |
| 1991 | 10 | 0 |
| 1992 | 13 | 0 |
| 1993 | 10 | 0 |
| 1994 | 17 | 0 |
| 1995 | 8 | 0 |
| 1996 | 7 | 0 |
| 1997 | 21 | 0 |
| 1998 | 17 | 0 |
| 1999 | 27 | 0 |
| 2000 | 36 | 0 |
| 2001 | 38 | 23 |
| 2002 | 41 | 59 |
| 2003 | 74 | 110 |
| 2004 | 59 | 119 |
| 2005 | 64 | 118 |
| 2006 | 54 | 109 |
| 2007 | 50 | 121 |
| 2008 | 66 | 110 |
| 2009 | 70 | 117 |
| 2010 | 71 | 155 |
| 2011 | 66 | 120 |
| 2012 | 116 | 128 |
| 2013 | 107 | 127 |
| 2014 | 134 | 145 |
| 2015 | 140 | 203 |
| 2016 | 172 | 195 |
| 2017 | 174 | 220 |
| 2018 | 142 | 163 |
| 2019 | 168 | 191 |
| 2020 | 135 | 151 |
| 2021 | 119 | 143 |
| 2022 | 99 | 182 |
| 2023 | 91 | 136 |
| 2024 | 105 | 152 |
| 2025 | 128 | 162 |
| 2026 | 63 | 79 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Apparatus for treating substrate and method for treating a substrate6 Oct 2026US 12,754,475 B2Semes Co., Ltd.
- Control of metallic contamination from metal-containing photoresist29 Sep 2026US 12,748,352 B2Lam Research Corporation
- Compound, binder resin, negative-type photosensitive resin composition, and display device comprising black bank formed using same15 Sep 2026US 12,736,876 B2LG Chem.Ltd.
- Substrate treatment method, substrate treatment apparatus, and computer storage medium8 Sep 2026US 12,733,422 B2Tokyo Electron Limited
- Pattern-forming composition1 Sep 2026US 12,724,350 B2Nissan Chemical Corporation
- Method and apparatus for fabrication of large area 3d photonic crystals with embedded waveguides8 Oct 2026US 2026/0310072 A1UNM Rainforest Innovations
- Polyimide-based resin precursor, photosensitive resin composition, method for producing resin film, and amic acid ester compound1 Oct 2026US 2026/0297261 A1Resonac Corporation
- Cleaning composition and method of forming photoresist pattern using the same1 Oct 2026US 2026/0297468 A1Dongwoo Fine-Chem Co., Ltd.
- Photoresist developer and methods of use1 Oct 2026US 2026/0299428 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Photosensitive resin composition, patterned cured product, production method for patterned cured product, and electric component24 Sep 2026US 2026/0293662 A1
Most cited
By later US patents
- Gate linewidth tailoring and critical dimension control for sub-100 nm devices using plasma etching534US 6,864,041 B2International Business Machines Corporation · 2005
- Method of depositing silicon oxide film by plasma enhanced atomic layer deposition at low temperature528US 8,197,915 B2ASM Japan K .K. · 2012
- Method for hardening a photoresist material formed on a substrate492US 6,121,158 ASony Corporation · 2000
- Photoresist double patterning487US 8,282,847 B2Lam Research Corporation · 2012
- Heating device, coating/developing system, heating method, coating/developing method, and recording medium having program for executing heating method or coating/developing method472US 8,927,906 B2Tokyo Electron Limited · 2015