Substrate treatment method, substrate treatment apparatus, and computer storage medium
AssigneeTokyo Electron Limited
InventorsKosuke Yoshihara, Yuichi Terashita, Yukinobu Otsuka, Shinsuke Takaki, Hiroki Tadatomo, Naoki Shibata
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Abstract
A substrate treatment method includes developing a substrate which has a coating film of a metal-containing resist formed thereon and has been subjected to an exposure treatment and a heat treatment after the exposure treatment. The developing includes exposing the substrate to an acid atmosphere being an atmosphere containing gas of a weak acid under a pressure of an atmospheric pressure or higher; and removing a product produced by a reaction between the metal-containing resist and the gas of the weak acid, by heating the substrate.
Claims7
A substrate treatment method comprising
- developing a substrate which has a coating film of a metal-containing resist formed thereon and has been subjected to an exposure treatment and a heat treatment after the exposure treatment,
- the developing comprising:
- exposing the substrate to an acid atmosphere being an atmosphere containing gas of a weak acid under a pressure of an atmospheric pressure or higher;
- and
- removing a product produced by a reaction between the metal-containing resist and the gas of the weak acid, by heating the substrate,
- wherein the developing further comprises
- before the exposing, developing the substrate with a developing solution so that a part of a portion to be removed by the development in the coating film of the metal-containing resist remains.
Dependencies are inferred from the claim text.