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US 2026/0297261 A1Published application
Polyimide-based resin precursor, photosensitive resin composition, method for producing resin film, and amic acid ester compound
AssigneeResonac Corporation
InventorsShintaro NAGAYAMA, Yohei ISHIKAWA, Mariko IWATA
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Abstract
A polyimide-based resin precursor includes at least one of a structural unit represented by the following formula (A1): or a structural unit represented by formula (A2): At least one of R2 or R3 is an optionally substituted aromatic group, and at least one of R2 or R3 is a group including a photopolymerizable group. R4 represents an aromatic group substituted with a group including a photopolymerizable group.
Claims5
A polyimide-based resin precursor, comprising at least one of a structural unit represented by the following formula (A1):
- or a structural unit represented by the following formula (A2):
- wherein in formula (A1), X1 represents a tetravalent organic group, R1 represents a divalent organic group, R2 and R3 each independently represent a monovalent organic group, at least one of R2 or R3 is an optionally substituted aromatic group, and at least one of R2 or R3 is a group including a photopolymerizable group, and
- wherein in formula (A2), X2 represents a trivalent organic group, R1 represents a divalent organic group, and R4 represents an aromatic group substituted with a group including a photopolymerizable group.
An amic ester compound represented by the following formula (I):
- wherein R15 represents a hydrogen atom or a methyl group, R16 represents an alkyl group or an aryl group, and X3 represents a methanediyl group, an ethane-1,2-diyl group, an ethene-1,2-diyl group, or a 1,2-phenylene group.
Dependencies are inferred from the claim text.