G03F 7/0757
Macromolecular compounds containing si-o, si-c or si-n bonds
Official title: {Macromolecular compounds containing Si-O, Si-C or Si-N bonds (G03F7/0752 takes precedence)}
G03F7/0757 (Macromolecular compounds containing si-o, si-c or si-n bonds) appears on 1,241 US grants and 1,350 published applications in this corpus.
Search patents in G03F- Granted patents
- 1,241
- Published applications
- 1,350
- Assignees
- 379
- Inventors
- 2,524
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 2 | 0 |
| 1980 | 3 | 0 |
| 1981 | 6 | 0 |
| 1982 | 3 | 0 |
| 1983 | 4 | 0 |
| 1984 | 6 | 0 |
| 1985 | 9 | 0 |
| 1986 | 9 | 0 |
| 1987 | 13 | 0 |
| 1988 | 19 | 0 |
| 1989 | 11 | 0 |
| 1990 | 7 | 0 |
| 1991 | 16 | 0 |
| 1992 | 17 | 0 |
| 1993 | 26 | 0 |
| 1994 | 19 | 0 |
| 1995 | 14 | 0 |
| 1996 | 10 | 0 |
| 1997 | 8 | 0 |
| 1998 | 11 | 0 |
| 1999 | 16 | 0 |
| 2000 | 26 | 0 |
| 2001 | 28 | 13 |
| 2002 | 32 | 53 |
| 2003 | 36 | 64 |
| 2004 | 44 | 70 |
| 2005 | 31 | 54 |
| 2006 | 39 | 45 |
| 2007 | 46 | 59 |
| 2008 | 30 | 56 |
| 2009 | 35 | 65 |
| 2010 | 30 | 63 |
| 2011 | 35 | 43 |
| 2012 | 39 | 44 |
| 2013 | 44 | 59 |
| 2014 | 63 | 50 |
| 2015 | 62 | 65 |
| 2016 | 53 | 50 |
| 2017 | 43 | 34 |
| 2018 | 26 | 57 |
| 2019 | 41 | 67 |
| 2020 | 38 | 65 |
| 2021 | 40 | 45 |
| 2022 | 35 | 48 |
| 2023 | 34 | 50 |
| 2024 | 33 | 42 |
| 2025 | 28 | 41 |
| 2026 | 16 | 48 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Photosensitive resin composition, photosensitive resin film, photosensitive dry film, and pattern formation method29 Sep 2026US 12,748,350 B2Shin-Etsu Chemical Co., Ltd.
- Composition for forming organic film, patterning process, and compound and polymer for forming organic film8 Sep 2026US 12,730,377 B2Shin-Etsu Chemical Co., Ltd.
- Method for preparing pixel define layer11 Aug 2026US 12,704,783 B2Duk San Neolux Co., Ltd.
- Semiconductor photoresist composition and method of forming patterns using the composition4 Aug 2026US 12,699,319 B2Dct Material LLC
- Photosensitive resin composition, photosensitive dry film, layered product, and pattern formation method4 Aug 2026US 12,699,322 B2Shin-Etsu Chemical Co., Ltd.
- Polysiloxane material and polysiloxane composition comprising the same24 Sep 2026US 2026/0288006 A1Merck Patent GmbH
- Negative type photosensitive composition17 Sep 2026US 2026/0277104 A1Merck Patent GmbH
- Silicone-containing copolymer, leveling agent, coating composition, resist composition, color filter, and method for producing silicone-containing copolymer10 Sep 2026US 2026/0265437 A1DIC Corporation
- Gas sensor10 Sep 2026US 2026/0266758 A1FaradaIC Sensors GmbH
- Resin Composition, Method for Producing Cured Film, Substrate with Multilayer Film, Method for Producing Substrate with Pattern, Method for Producing Patterned Cured Film, and Method for Producing Resin Composition27 Aug 2026US 2026/0250509 A1Central Glass Company, Limited
Most cited
By later US patents
- Partially crosslinked polymer for bilayer photoresist479US 6,589,707 B2Hyundai Electronics Industries Co., Ltd. · 2003
- Partially crosslinked polymer for bilayer photoresist471US 6,811,960 B2Hyundai Electronics Industries Co., Ltd. · 2004
- Photoresist polymer and photoresist composition containing the same471US 7,279,256 B2Hynix Semiconductor Inc. · 2007
- Polyurethane resins having multiple mechanisms of hardening for use in producing three-dimensional objects271US 9,453,142 B2Carbon3D, Inc. · 2016
- Process for the production of built-up films by the stepwise adsorption of individual monolayers215US 4,539,061 AYeda Research and Development Co. Ltd. · 1985