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US 2026/0277104 A1Published application
Negative type photosensitive composition
AssigneeMerck Patent GmbH
InventorsAkira Yamasaki, Atsuko Noya
Life of this patent
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Abstract
[Problem] To provide a negative type photosensitive composition capable of being cured at a low temperature. [Means for Solution] A negative type photosensitive composition comprising (I) a polysiloxane A having a certain structure, (II) a polymerization initiator, (III) a compound containing two or more (meth)acryloyloxy groups, (IV) a thiol compound containing two or more sulfanyl groups, and (V) a solvent.
Claims11
A negative type photosensitive composition comprising the following:
- (I) a polysiloxane A comprising a repeating unit represented by the formula (Ia):
- where
- RIa1 is a C1-5 alkylene group, where any of —CH2— in the alkylene group can be replaced with —O—,
- RIa2 is each independently hydrogen, a C1-5 alkyl group or a C1-5 alkylene group, where any of —CH2— in the alkyl group and the alkylene group can be replaced with —O—, where when RIa2 is an alkylene group, the bond that is not bonded to nitrogen is bonded to Si atoms contained in the polysiloxane A;
- (II) a polymerization initiator;
- (III) a compound containing two or more (meth)acryloyloxy groups;
- (IV) a thiol compound containing two or more sulfanyl groups;
- and
- (V) a solvent.
6 more elements
Dependencies are inferred from the claim text.