G01R 31/31905
Interface with the device under test [dut]
Official title: {Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture}
G01R31/31905 (Interface with the device under test [dut]) appears on 597 US grants and 520 published applications in this corpus.
Search patents in G01R- Granted patents
- 597
- Published applications
- 520
- Assignees
- 269
- Inventors
- 1,228
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 3 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 6 | 0 |
| 1992 | 10 | 0 |
| 1993 | 7 | 0 |
| 1994 | 2 | 0 |
| 1995 | 6 | 0 |
| 1996 | 8 | 0 |
| 1997 | 5 | 0 |
| 1998 | 11 | 0 |
| 1999 | 10 | 0 |
| 2000 | 10 | 0 |
| 2001 | 23 | 4 |
| 2002 | 27 | 24 |
| 2003 | 25 | 28 |
| 2004 | 26 | 24 |
| 2005 | 23 | 45 |
| 2006 | 26 | 23 |
| 2007 | 28 | 31 |
| 2008 | 21 | 38 |
| 2009 | 20 | 26 |
| 2010 | 29 | 17 |
| 2011 | 22 | 11 |
| 2012 | 11 | 4 |
| 2013 | 14 | 5 |
| 2014 | 6 | 11 |
| 2015 | 4 | 13 |
| 2016 | 10 | 5 |
| 2017 | 13 | 10 |
| 2018 | 9 | 6 |
| 2019 | 7 | 18 |
| 2020 | 23 | 25 |
| 2021 | 19 | 38 |
| 2022 | 22 | 30 |
| 2023 | 36 | 30 |
| 2024 | 23 | 25 |
| 2025 | 27 | 17 |
| 2026 | 13 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Solderless high current, high voltage, high bandwidth test fixture22 Sep 2026US 12,742,819 B2Keithley Instruments, LLC
- Test control device and operating method thereof8 Sep 2026US 12,730,152 B2Lite-On Technology Corporation
- Testing a control device using a test assembly25 Aug 2026US 12,716,946 B2dSPACE GmbH
- Methods and devices for testing a device under test using test site specific thermal control signaling4 Aug 2026US 12,699,128 B2Advantest Corporation
- Device and thermal tester for thermal testing dies of an integrated circuit9 Jun 2026US 12,650,462 B2AEM Singapore Pte. Ltd.
- Systems and methods for multi-channel parallel device testing24 Sep 2026US 2026/0287657 A1Chroma Ate Inc.
- System and method for simulation of characteristic artificial intelligence (ai) load conditions30 Jul 2026US 2026/0219319 A1VERTIV INTERNATIONAL GmbH
- Esd (electrostatic discharge) verification for large io (input/output) arrays25 Jun 2026US 2026/0177611 A1Intel Corporation
- System and methods for iot device testing, provisioning, and lifecycle management25 Jun 2026US 2026/0177617 A1Boulder Engineering Studio, LLC
- Advanced Complex Impedance Matching Capabilities for On–Wafer Antenna Transceiver Measurements7 May 2026US 2026/0126487 A1FormFactor, Inc.
Most cited
By later US patents
- Making and testing an integrated circuit using high density probe points307US 5,103,557 A1992
- Full wafer integrated circuit testing device306US 5,070,297 ATexas Instruments Incorporated · 1991
- Differential signal transmission circuit244US 6,208,161 B1Advantest Corporation · 2001
- Integrated circuit test apparatus test head129US 4,517,512 AMicro Component Technology, Inc. · 1985
- Method of repairing defective traces in an integrated circuit structure126US 5,725,995 AElm Technology Corporation · 1998